Page 252 - Book Hosokawa Nanoparticle Technology Handbook
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4.5 STRUCTURE CONTROL OF NANOPARTICLE COLLECTIVES BY SINTERING AND BONDING FUNDAMENTALS
Manufacturer Asahi Glass Co., Ltd. Kyocera Corp. Dupont NEC Corp. Noritake Co., Ltd. Hitachi, Ltd. Fujitsu Limited Matsushita Electric Industrial Co., Ltd. Murata Manufacturing Co., Ltd. Corp. IBM NGK Spark Plug Co., Ltd. Taiyo Yuden Co., Ltd. Toshiba Corp. Murata Manufacturing Co., Ltd.
Dielectric constant at 1 MHz 7.4 7.9 5.0 6.2 8.0 7.8 4.7 3.4 7.4 7.0 4.9 7.4 7.7 7.4 5.0 4.9 5.0 7 8.5 6.1
Thermal conductivity (W/m°C) 4.2 2.5 2 3 —- 4.2 3.5 —- 8.4 1.7 4 3 2.5 5.6 —- 3 8.4 5.4 8.0
Thermal expansion coefficient (ppm/°C) 5.9 6.3 4.0 4.2 7.9 4.2 3.5 3.2 7.6 5.5 4.0 6.0 5.5 10.6 3.0 3.0 4.8 5.4 8.0
Bending strength (MPa) 235 204 190 210 200 300 140 85 140 200 200 260 200 250 210 200 250 200 200
Conductor a (3) (4) (2) (2) (1) (1)(3)(4) (3) (2) (1) (2)(3) (1)(3) (2) (2) (1)(2)(3) (2) (2) (4) (2) (3)(4) (2)
Major materials for LTCC and their properties [1].
Material system Al 2 O 3 Forsterite BSG BSG Al 2 O 3 BSG Al 2 O 3 SiO 2 Cordierite Crystallized Glass Al 2 O 3 Al 2 O 3 CaZrO 3 Glass Al 2 O 3 PbO-BSG BSG Cordierite SiO 2 BSG Cordierite SiO 2 Al 2 O 3 Forsterite Glass BaO-Al 2O 3- Al 2 O 3 ZrSiO 2 BSG Al 2 O 3 BSG Al 2 O 3 PbO-BSG CaO-Al 2O 3-SiO 2 - Al 2 O 3 B 2 O 3 Glass Li 2O-MgO-ZnO- B 2 O 3 -SiO 2 MgAl 2 O 4 Cordierite ZnO-MgO-Al 2O 3 -SiO 2 Al 2 O 3 -CaO-SiO 2 - MgO-B 2 O 3 BaSnB 2O 6 BaO-Al 2O 3-SiO 2 a Conductive metal: (1) Ag, (2) Cu, (3) Ag-Pd, (4) Au.
Table 4.5.1 Glass composite system Crystallized glass system Non-glass system Note: BSG, boron silicate glass.
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