Page 526 - Book Hosokawa Nanoparticle Technology Handbook
P. 526

APPLICATIONS                                    20 ELECTRICAL CONDUCTIVE CNT DISPERSED Si N CERAMICS
                                                                                                  3  4
                  [14] K. Yamamoto, M. Higuchi, S. Shiki, M. Tsuruta and  [19] A. Pogntsch, F.P.  Wenzl, E.J.W. List, G. Leising,
                      H. Chiba: Nature, 415, 509–511 (2002).         A.C. Grimsdare and K. Muellen:  Adv. Mater.,  14,
                  [15] S. Yokoyama, T. Nakahama, H. Miki and S. Mashiko:  1061–1064 (2002).
                      Thin Solid Films, 438–439, 452–456 (2003).  [20] P. Furuta, J. Brooks, M.E.  Thompson and J.M.J.
                  [16] S. Yokoyama, A. Otomo, T. Nakahama and S. Mashiko:  Fréchet: J. Am. Chem. Soc., 125, 13165–13172 (2003).
                      Thin Solid Films, 393, 124–128 (2001).     [21] T.D. Anthopoulos, J.P.J. Markham, E.B. Namdas and
                  [17] S. Yokoyama, A. Otomo and S. Mashiko: Appl. Phys.  I.D.W. Samuel:  Appl. Phys. Lett.,  82, 4824–4826
                      Lett., 80, 7–9 (2002).                         (2003).
                  [18] N. Satoh, T. Watanabe, Y. Iketaki, T. Omatsu, M. Fujii  [22] A. Hagfeldt, M. Grätzel: Chem. Rev., 95, 49–68 (1995).
                      and K. Yamamoto: Polym. Adv. Technol., 15, 159–163  [23] N. Satoh,  T. Nakashima and K. Yamamoto:  J. Am.
                      (2005).                                        Chem. Soc., 127, 13030–13038 (2005).


                            APPLICATION 20

                   20       ELECTRICAL CONDUCTIVE CNT DISPERSED Si N CERAMICS
                                                                          3
                                                                            4



                  Si N ceramics is one of the typical engineering     10 2
                    3
                      4
                  ceramics with high strength, hardness, fracture tough-
                  ness, corrosion resistance and wear resistance.      -1
                  Although electrical insulation is also characteristic of  10
                  Si N ceramics, electrical conductivity is needed
                    3
                      4
                  depending on the application. Recently, carbon nan-  10 -4
                  otubes (CNTs) with high thermal conductivity, elec-  Electrical conductivity (Sm -1 )
                  trical conductivity and mechanical properties have  10 -7
                  been developed. CNT/metal or polymer composites
                  have been developed to improve some properties by    -10
                  adding the small amount of CNTs [1, 2] as well as  10
                  CNT dispersed Al O ceramics is also reported [3, 4, 5].
                                  3
                                2
                  Although it should be possible to improve electrical  10 -13
                  conductivity of Si N ceramics by using CNTs, there     0         5          10         15
                                  4
                                3
                  is no literature on the dense CNT dispersed Si N 4               CNT content (wt%)
                                                          3
                  ceramics. The Y O –Al O –TiO –AlN [6] as the addi-
                               2
                                 3
                                      3
                                    2
                                           2
                  tive for lower temperature densification of Si N has  Figure 20.1
                                                         4
                                                       3
                  been studied. In this section, CNT dispersed Si N 4  Electrical conductivity of CNT dispersed Si N ceramics.
                                                                                                3
                                                                                                  4
                                                          3
                  ceramics developed by using the above sintering aid
                  will be introduced [7].
                    Fig. 20.1 shows the electrical conductivity of CNT-
                  dispersed Si N ceramics fabricated by gas-pressure
                              4
                            3
                  sintering technique. Although Si N ceramics without
                                              4
                                            3
                  CNTs are an insulator, their electrical conductivity
                  appeared suddenly in the sample with 1.8 wt% CNT
                  addition, having a value of 2.8 S/m. It decreased
                  with an increasing amount of CNTs and disappeared
                  at 3.6  wt% CNT addition. It then began increasing
                  over 4.2 wt% CNT addition. The SEM photographs in
                  Fig. 20.2 confirmed that   -Si N grains in Si N 4
                                              4
                                                          3
                                           3
                  ceramics containing up to 3 wt% CNTs elongated to
                  as large as those in the sample without CNTs, and that
                  CNTs remained in the grain boundary of Si N 4
                                                          3
                  ceramics. CNTs should form an electrical conduction  Figure 20.2
                  path in Si N ceramics, and it was observed that the  Microstructure of CNT dispersed Si N ceramics (CNT:
                                                                                           3
                                                                                             4
                            4
                          3
                  largest amount of CNTs remained in the sample with  1.8 wt%, 1,800°C, 2 h, 0.9 MPaN ).
                                                                                         2
                  498
   521   522   523   524   525   526   527   528   529   530   531