Page 126 - Rashid, Power Electronics Handbook
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7 Insulated Gate Bipolar Transistor                                                                 113

                 (C ) is implicitly de®ned by the emitter-base voltage as a                           GATE
                   eb
                 function of base charge; I ceb  is the emitter-base capacitor
                 current that de®nes the rate of change of the base charge.  CATHODE
                 The current through the collector-emitter redistribution capa-                         g
                 citance (I ccer ) is part of the collector current, which in contrast                             xa
                 to I css  depends on the rate of change of the base-emitter
                 voltage; I bss  is part of the base current that does not ¯ow                  C             C
                 through C eb  and does not depend on the rate of change of                      gs            gd
                 base-collector voltage.
                   Impact ionization causes carrier multiplication in the high  c              s
                 electric ®eld of the base-collector depletion region. This carrier                        I mos  d
                                                                                                C
                 multiplication generates an additional base-collector current                   dsj
                 component (I   ), which is proportional to I , I  , and the
                             mult                      c  mos
                 multiplication factor. The resulting Saber IGBT model should
                 be able to describe accurately the experimental results for the  I
                                                                          c         I
                 range of static and dynamic conditions where IGBT operates.        mult
                 Therefore, the model can be used to describe the steady-state     I                           b      I
                                                                                   ccer                                ceb
                 and dynamic characteristics under various circuit conditions.
                                                                      I                                  I
                   The currently available models have different levels of  css                          bss
                                                                                  C cer                              C  eb
                 accuracy at the expense of speed. Circuit issues such as
                 switching losses and reliability are strongly dependent on the
                 device and require accurate device models. However, simpler
                 models are adequate for system-oriented issues such as the
                 behavior of an electric motor driven by a PWM converter.                      e
                 Finite-element models have high accuracy, but are slow and
                 require internal device structure details. Macromodels are fast               R b
                 but have low accuracy, which depends on the operating point.
                                                                                               a
                 Commercial circuit simulators have introduced 1D physics-
                                                                                            ANODE
                 based models, which offer a compromise between the ®nite-
                 element models and macromodels.                                  FIGURE 7.17  IGBT circuit model.


                                                                      power module (IPM) is an attractive power device integrated
                 7.8 Applications                                     with circuits to protect against overcurrent, overvoltage, and
                                                                      overheating. The main application of IGBT is for use as a
                                                                      switching component in inverter circuits, which are used in
                 Power electronics evolution is a result of the evolution of  both power supply and motor drive applications. The advan-
                 power semiconductor devices. Applications of power electro-  tages of using IGBT in these converters are simplicity and
                 nics are still expanding in industrial and utility systems. A  modularity of the converter, simple gate drive, elimination of
                 major challenge in designing power electronic systems is  snubber circuits due to the square SOA, lower switching loss,
                 simultaneous operation at high power and high switching  improved protection characteristics in case of overcurrent and
                 frequency. The advent of IGBTs has revolutionized power  short-circuit fault, galvanic isolation of the modules, and
                 electronics by extending the power and frequency boundary.  simpler mechanical construction of the power converter.
                 During the last decade the conduction and switching losses of  These advantages have made the IGBT the preferred switching
                 IGBTs have been reduced in the process of transition from the  device in the power range below 1 MW.
                 ®rst- to the third-generation IGBTs. The improved character-  Power supply applications of IGBTs include uninterruptible
                 istics of the IGBTs have resulted in higher switching speed and  power supplies (UPS) as is shown in Fig. 7.18, constant-
                 lower energy losses. High-voltage IGBTs are expected to take  voltage constant-frequency power supplies, induction heating
                 the place of high-voltage GTO thyristor converters in the near  systems, switch mode power supplies, welders (Fig. 7.19),
                 future. To advance the performance beyond the third-genera-  cutters, traction power supplies, and medical equipment
                 tion IGBTs, the fourth-generation devices will require exploit-  (CT, X-ray). Low-noise operation, small size, low cost and
                 ing ®ne-line lithographic technology and employing the  high accuracy are characteristics of the IGBT converters in
                 trench technology used to produce power MOSFETs with  these applications. Examples of motor drive applications
                 very low on-state resistance. Intelligent IGBT or intelligent  include the variable-voltage variable-frequency inverter as is
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