Page 122 - Rashid, Power Electronics Handbook
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7 Insulated Gate Bipolar Transistor                                                                 109

                                                                      provide the required gate charge for zero current switching
                                                                      and zero voltage switching. The delay of the input signal to the
                                                                      gate drive should be small compared to the IGBT switching
                                                                      period and therefore the gate drive speed should be designed
                                                                      properly to be able to use the advantages of faster switching
                                                                      speeds of the new generation IGBTs.



                                                                      7.6.1 Conventional Gate Drives
                                                                      The ®rst IGBT gate drives used ®xed passive components and
                                                                      were similar to MOSFET gate drives. Conventional gate-drive
                                                                      circuits use a ®xed gate resistance for turn-on and turn-off as
                                                                      shown in Fig. 7.12.
                                                                        The turn-on gate resistor R gon  limits the maximum collector
                        FIGURE 7.11  The IGBT safe operating area (SOA).  current during turn-on, and the turn-off gate resistor R goff
                                                                      limits the maximum collector-emitter voltage. In order to
                   The IGBT SOA is indicated in Fig. 7.11. Under short  decouple the dv =dt and di =dt control an external capaci-
                                                                                              c
                                                                                   ce
                 switching times the rectangular SOA shrinks by an increase  tance C can be used at the gate, which increases the time
                                                                            g
                 in the duration of the on-time. Thermal limitation is the  constant of the gate circuit and reduces the di =dt as shown in
                                                                                                           c
                 reason for smaller SOA and the lower limit is set by dc  Fig. 7.13. However, C does not affect the dv =dt transient,
                                                                                                            ce
                                                                                        g
                 operating conditions. The device switching loci under hard  which occurs during the Miller plateau region of the gate
                 switching (dashed lines) and zero voltage or zero current  voltage.
                 switching (solid lines) is also indicated in Fig. 7.11. The
                 excursion is much wider for switch-mode hard-switching
                 applications than for the soft-switching case and therefore a  7.6.2 New Gate-Drive Circuits
                 much wider SOA is required for hard-switching applications.
                                                                      In order to reduce the delay time required for the gate voltage
                 At present, IGBTs are optimized for hard-switching applica-         ÿ
                                                                      to increase from v to V ðthÞ, the external gate capacitor can
                                                                                     gg
                                                                                          ge
                 tions. In soft-switching applications the conduction losses of
                 IGBT can be optimized at the cost of smaller SOA. In this case
                 the p-base doping can be adjusted to result in a much lower
                 threshold voltage and hence forward voltage drop. However, in
                 hard-switching applications the SOA requirements dominate
                 over forward voltage drop and switching time. Therefore, the
                 p-base resistance should be reduced, which causes a higher
                 threshold voltage. As a result, the channel resistance and
                 forward voltage drop will increase.

                 7.6 Gate-Drive Requirements
                                                                      FIGURE 7.12  Gate-drive circuit with independent turn-on and turn-off
                 The gate-drive circuit acts as an interface between the logic  resistors.
                 signals of the controller and the gate signals of the IGBT,
                 which reproduces the commanded switching function at a
                 higher power level. Nonidealities of the IGBT such as ®nite
                 voltage and current rise and fall times, turn-on delay, voltage
                 and current overshoots, and parasitic components of the
                 circuit cause differences between the commanded and real
                 waveforms. Gate-drive characteristics affect the IGBT non-
                 idealities. The MOSFET portion of the IGBT drives the base of
                 the pnp-transistor and therefore the turn-on transient and
                 losses are greatly affected by the gate drive.
                   Due to lower switching losses, soft-switched power conver-
                 ters require gate drives with higher power ratings. The IGBT  FIGURE 7.13  External gate capacitor for decoupling dv ce =dt and di c =dt
                 gate drive must have suf®cient peak current capability to  during switching transient.
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