Page 7 - Semiconductor Manufacturing Handbook

Geng(SMH)_CH01.qxd 04/04/2005 19:32 Page 1.6

HOW SEMICONDUCTOR CHIPS ARE MADE

1.6 SEMICONDUCTOR FUNDAMENTALS AND BASIC MATERIALS

SiO 2

Si-substrate

(a) Add oxidation layer on silicon base material (the right illustration is the cross section
from the front side)

Photoresist

SiO 2

Si-substrate

(b) Add photoresist layer

(c) Mask for patterning (d) Pass ultraviolet light through mask

Photoresist Photoresist

SiO 2

Si-substrate

(e) After revealing the mask pattern
FIGURE 1.3 Process steps for patterning silicon dioxide: (a) add oxidation layer on silicon base,
(b) add photoresist layer, (c) mask for patterning, (d) pass ultraviolet light through mask, (e) after removing
photoresist and revealing the mask pattern, ( f ) after etching of silicon dioxide, (g) after removing
photoresist.

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