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Six Sigma for Electronics Design and Manufacturing
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                     bad test effectiveness, and good test effectiveness. They are measured
                     as percentage values:
                     1. Test coverage (%): the test coverage for a given fault. Coverage of 0
                        for a defect category means that this defect is not tested.
                     2. Bad test effectiveness (%): the percentage of bad components that
                        fail a test. Thus, a tester with 100% bad test effectiveness will fail
                        all bad items, whereas one with 0% bad test effectiveness will pass
                        all bad items.
                     3. Good test effectiveness (%): the percentage of good parts that pass
                        a test. Thus, a tester with 100% good test effectiveness will pass all
                        good items, whereas one with 0% good test effectiveness will fail all
                        good items.
                     4.4.4 Factors affecting test operation parameters
                     Factors that affect test effectiveness can be divided into three broad
                     categories:  technology,  management  decisions,  and  design  for  test
                     (DFT) efforts. They are listed in Table 4.9 and further explained in
                     the  next  section.  A  factor-based  model  could  be  created  in  order  to
                     make PCB design decisions during the development stage. The model
                     could help the design team investigate the effect that different design
                     choices would have on the test effectiveness.
                     4.4.5  Test coverage
                     Test coverage (also called defect coverage) is a measure of the ability
                     of a tester to detect defects. It is the percentage of those defects that


                                   Table 4.9 Factors that affect test effectiveness
                     Category               Examples
                     Circuits tested        Microwave circuits (require shielding)
                                            Digital versus analog versus mixed
                     Manufacturing          Through-hole versus SMT
                                            Test pad size
                                            Pitch size
                                            Nodal access
                                            Fixture design and fit
                     Management decisions   Time and resources for test and fixture development
                                            Time planned for in-line test
                     Design for test (DFT)   Design review for DFT
                                            Use of built-in self-test (BIST)
                                            Unit under test memory space dedicated to test
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