Page 119 - An Introduction to Microelectromechanical Systems Engineering
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98                      MEM Structures and Systems in Industrial and Automotive Applications

                 reach a dynamic peak of 10,000G! In addition to achieving a large impact, the drop
                 test excites the various modes of resonance that are liable to cause catastrophic
                 failure.
                    While many companies offer micromachined acceleration sensor products, a
                 representative set of only four accelerometers follows next, each unique in its design
                 and fabrication.

                 Piezoresistive Bulk Micromachined Accelerometer
                 Until only recently, piezoresistive-type acceleration sensors were widely available.
                 Many companies, including GE NovaSensor of Fremont, California, and IC Sensors
                 of San Jose, California (a division of Measurement Specialties, Inc., of Fairfield,
                 New Jersey), offered products using anisotropically etched silicon inertial mass and
                 diffused piezoresistive sense elements. But these products were retired because they
                 could not meet the aggressive pricing requirements of the automotive industry. The
                 product introduction in 1996 by Endevco Corp., of San Juan Capistrano, Califor-
                 nia, indicates that piezoresistive accelerometers remain in this highly competitive
                 market (see Figure 4.15).
                    The Endevco sensor consists of three substrates: a lower base; a middle core con-
                 taining a hinge-like spring, the inertial mass, and the sense elements; and finally a top
                 protective lid [19]. The inertial mass sits inside a frame suspended by the spring. Two
                 thin boron-doped piezoresistive elements in a Wheatstone bridge configuration span
                 the narrow 3.5-µm gap between the outer frame of the middle core and the inertial
                 mass. The piezoresistors are only 0.6 µm thick and 4.2 µm long and are thus very sen-
                 sitive to minute displacements of the inertial mass. The output in response to an
                 acceleration equal to 1G in magnitude is 25 mV for a Wheatstone bridge excitation of
                 10V. The thick and narrow hinge structure allows displacement within the plane of


                                                              Acceleration

                                                                        Outer frame
                         Base





                                                                   Mass

                                                    Hinge
                       Bondpads

                           {110} plane
                                                                       Lid
                                       Boron doped
                                       piezoresistor
                 Figure 4.15  Illustration of a piezoresistive accelerometer from Endevco Corp., fabricated using
                 anisotropic etching in a {110} wafer. The middle core contains the inertial mass suspended from a
                 hinge. Two piezoresistive sense elements measure the deflection of the mass. The axis of sensitivity
                 is in the plane of the middle core. The outer frame acts as a stop mechanism to prevent excessive
                 accelerations from damaging the part. (After: [19].)
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