Page 117 - An Introduction to Microelectromechanical Systems Engineering
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96                      MEM Structures and Systems in Industrial and Automotive Applications

                 because it can be deposited under low tensile stress, and it retains its structural integ-
                 rity in most anisotropic etch solutions. The thin-film heaters and sense elements are
                 deposited next by sputtering a thin metal layer (e.g., platinum or nickel) or by the
                 chemical vapor deposition of a heavily doped layer of polysilicon. The thin metal
                 film or polysilicon are then patterned using standard lithography followed by an
                 appropriate etch step. An insulating passivation layer, preferably made of silicon
                 nitride, encapsulates and protects the heating and sense elements. Both silicon
                 nitride layers must then be lithographically patterned in the shape of the two sus-
                 pended membranes and consequently etched to expose the silicon regions outside of
                 the membrane outline. The final step involves the etching of the silicon in potassium
                 hydroxide or a similar anisotropic etch solution to form the deep cavity. The etch
                 first proceeds in the open silicon regions, and then it progresses underneath the sili-
                 con nitride thin film, removing all the silicon and resulting in the suspended silicon
                 nitride membranes. The reason the etch proceeds underneath the silicon nitride layer
                 is because its orientation is in the <100> direction. The etch stops on the {111} crys-
                 tallographic planes along the periphery of the open silicon areas.

                 Acceleration Sensors
                 The first demonstration of a micromachined accelerometer took place in 1979 at
                 Stanford University [17], but it took nearly 15 years before such devices became
                 accepted mainstream products for large-volume applications (see Table 4.3). The
                 overall market for silicon microaccelerometers has been steadily increasing, reach-
                 ing an estimated $319 million in 2000 [18] and driven primarily by the need for
                 crash sensing in airbag deployment systems. The increase in unit volume has been
                 accompanied by a steady decrease in pricing for automotive applications from an
                 estimated $10 per unit in the early 1990s to less than $2 per unit in 2002. Clearly,
                 low-volume pricing for custom designs remains well above quoted figures for the
                 high-volume automotive markets.




          Table 4.3  Some Applications for Micromachined Accelerometers
          Measurement         Application
          Acceleration        Front and side airbag crash sensing
                              Electrically controlled car suspension
                              Safety belt pretensioning
                              Vehicle and traction control systems
                              Inertial measurement, object positioning, and navigation
                              Human activity for pacemaker control
          Vibration           Engine management
                              Condition-based maintenance of engines and machinery
                              Security devices
                              Shock and impact monitoring
                              Monitoring of seismic activity
          Angles of inclination  Inclinometers and tilt sensing
                              Vehicle stability and roll
                              Headlight leveling
                              Computer peripherals (e.g., joystick, head mounted displays)
                              Handwriting recognition (e.g., SmartQuill from British Telecom plc)
                              Bridges, ramps, and construction
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