Page 255 - An Introduction to Microelectromechanical Systems Engineering

234 Packaging and Reliability Considerations for MEMS

†
of C C C C C C C
Types Packaging M, P, M, P, M, P, M, P, M, P, C M, C M, C M, C M, C M, C M, C M, M, P, M, P, C M,

and
Calibration Compensation Yes Yes Yes Yes Yes Yes No Possibly Possibly No No No No Possibly

Thermal Isolation No Yes No No No No No Possibly Possibly No Yes No No No No

Heat Sinking No No No No No No No Possibly Possibly Possibly Possibly No No No No

Stress Isolation Yes No Possibly Possibly No No No No No No No No No No No

Hermetic Sealing Possibly No Yes Yes No Possibly Yes Yes No No No No No No No

Transparent Window No No No No No No Yes Yes No No Possibly Yes No Possibly No

Media Contact Yes Yes No No Yes Yes No No Yes Yes Yes Yes Yes Yes Yes
Requirements Fluid Ports Yes Yes No No Yes Yes No No Yes Yes Yes Yes Yes Yes Yes

Packaging Electrical Contacts Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes No No No

MEMS cycler

of switch
Diversity Acceleration rate Microphone Hydrophone thermal Electrophoresis mixer amplifier

The Pressure Flow Yaw Optical Display Valve Pump PCR Nozzles Fluid Fluid * Fluid includes liquid or gas. † P: plastic, M: metal, C: ceramic

8.4
Table Sensors Actuators Passive