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Earth Electrodes, Protective Conductors       195


                                  FIGURE 11.7 The
                                  supplementary
                                  bonding between
                                  ECPs carries the
                                  fault current.





                                     If the supplementary bonding conductor connects an ECP to an
                                  EXCP, as per IEC 60364–5-54, its conductance must be at least half that
                                  of the PE serving the ECP. Also, in this case, a current divider takes
                                  place and the EXCP carries part of the fault current.


                                  11.4.1 Where Should We Use Equipotential
                                          Bonding Conductors?
                                  As we have already substantiated, the only reason to employ an
                                  equipotential bonding conductor is to eliminate or reduce potential
                                  differences in the case of faults. However, an erroneous application
                                  of this concept may induce designers to bond each and every metal
                                  part in the vicinity of equipment. An undue link between ECPs and
                                  metal objects, which are not required to be bonded, causes the safety
                                  to decrease, because the fault potential arising within the ECP may be
                                  transferred to that metal part.
                                     As an example of a “legitimate” bonding conductor, let us consider
                                  a panelboard, whose door contains live conductors (e.g., door with
                                  controls or instrumentation) (Fig. 11.8).
                                     This piece of equipment is composed of a “core” (i.e., the panel
                                  itself) and a “satellite” (i.e., the “active” door). Both the core and satel-
                                  lite are ECPs since, by definition, they are normally “dead,” but likely
                                  to become live upon failure of their basic insulations. Both panelboard
                                  and door must be bonded to the grounding system to allow a prompt
                                  disconnection of supply upon ground faults.
                                     While the enclosure of the “core” is bonded to the grounding bus
                                  within the panel, which is linked to the earthing system, the door
                                  might simply employ an equipotential bonding conductor between
                                  itself and the “core,” as shown in Fig. 11.8. The equipotential bonding
                                                                               5
                                  conductor, by bypassing the resistance of the hinges, allows a clear
                                  path to the ground current and a prompt intervention of the protective
                                  device, should the door fail.
                                     On the other hand, a “plain” door (i.e., with no live parts on it)
                                  is neither an ECP nor an EXCP and therefore there is no need for
                                  bonding jumpers. The presence of a bonding conductor between the
                                  door and the frame decreases the safety, as a fault in the panelboard
                                  also energizes the door. As a consequence, the probability for persons
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