Page 211 - Electrical Safety of Low Voltage Systems
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194   Chapter Eleven









                                                                              no main bonding







                                                                    Is













                                     Main bonding         No main bonding




                                                                    Supplementary  No supplementary
                                                                      bonding      bonding
                                  FIGURE 11.6 Flowchart of the decision-making process for main bonding.


                                        2
                                  16 mm (aluminum), when they are protected against mechanical
                                                                 2
                                                 2
                                  damage, or 4 mm (copper)/16 mm (aluminum), when protection
                                  against mechanical damage is not provided. In addition, a supple-
                                  mentary bonding conductor, which connects two ECPs (Fig. 11.7),
                                  must have a cross-sectional area not less than that of the smaller PE
                                  serving the ECPs. In the case of ground faults, in fact, this SB will
                                  carry part of the fault current due to the current divider taking place
                                  between the two PEs.



                                                                2
                                                                              2
                                             2
                                   Copper (mm )    Aluminum (mm )     Steel (mm )
                                        6                16               50
                                  TABLE 11.8  Minimum Standard Cross-Sectional Area for Main
                                  Equipotential Bonding Conductors
   206   207   208   209   210   211   212   213   214   215   216