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THERMOSETS


                             3.52                        CHAPTER 3


                                              TABLE 3.51  Bis-Maleimide Cured Properties
                                               Flexural modulus, 25°C  4000 kpsi
                                                250°C               3200 kpsi
                                                Aged 3000 hr/250°C  2600 kpsi
                                               Flexural strength, 25°C  70 kpsi
                                                250°C                50 kpsi
                                                Aged 3000 hr/250°C   26 kpsi
                                               Tensile strength      50 kpsi
                                               Compressive strength  50 kpsi
                                               Notched impact strength  13 kpsi
                                               T g                  296°C
                                                                      14
                                               Volume resistivity  6 × 10  Ω-cm
                                               Dielectric constant   4.5
                                               Dissipation factor    0.012
                                               Dielectric strength  25 kV/mm









                                     FIGURE 3.46 Acetylene-terminated imide oligomers.

                             316°C, they give laminates with extreme heat resistance (Table 3.52). The mechanism of
                             the cure reaction is complex, probably producing a variety of aromatic and fused-ring
                             structures (Fig. 3.47).
                               3.1.6.3.3 Nadimide-Terminated Oligomers. Research at NASA, the U.S. Air Force,
                             and industrial laboratories has developed a series of thermoset polyimdes that are made by
                             impregnating the monomers into laminating fabric and then polymerizing and cross-link-
                             ing them in situ. The body of the polyimide oligomer is made from benzophenone tetra-
                             carboxylic acid ester or bisphenyl hexfluoropropene tetracarboxylic acid ester reacting
                             with an aromatic diamine such as phenylene diamine or methylene dianiline (Fig. 3.48).
                             The end-groups of the oligomer are made by end-capping with norbornene dicarboxylic
                             acid ester. And thermosetting cross-linking cure occurs by addition polymerization of the
                             C=C bonds in the norbornene ring. Laminate properties are very good (Table 3.53), and
                             heat aging resistance is promising (Table 3.54). More recently, dinadimide end-capping
                             (Fig. 3.49) has reached use temperatures of 260 to 290°C.
                             3.1.6.4 Polyimide Applications. Polyimides are used where their lubricity, low coeffi-
                             cient of thermal expansion, heat resistance, and radiation resistance are required. Typical
                             uses include bearings and piston rings in jet engines, appliances, office equipment, com-





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