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useful for the system designer. The components can be realized at any desired value or
specification (within the boundaries of the technology), and parasitic effects due to
interconnections are significantly reduced, resulting in an improvement in performance.
For RF integration, the filters provide a lower insertion loss with better rejection while
active devices such as oscillators have better phase noise using the SOP technology
rather than the SOC. Similarly, for digital integration, embedded decoupling capacitors,
which can be connected to switching digital circuits with a low-inductance interconnection,
can provide improved signal and power integrity. Above all, the maximum benefit
achievable using SOP is the ability to manage electromagnetic interference, a problem of
paramount importance in mixed-signal integration. However, the design of embedded
components in mixed-signal environments can involve many challenges such as longer
design time, requiring extensive electromagnetic analysis. Hence, new technologies need
to be supported by new design tools that become necessary to help the designer with the
design of such elements and shorten the design time.
A mixed-signal system has to be designed to reduce the interference between
components having different signal levels. For example, switching currents from digital
ICs need to be isolated from sensitive RF signals. One such technology presented in this
chapter is the electromagnetic bandgap (EBG) structure, which can create isolated
islands on a power delivery network in a specified frequency range.
This chapter presents advanced design concepts including embedded components
that are enabled by the SOP technology. A chip-package codesign methodology is
introduced for maximizing performance and area. This chapter also presents algorithms
and ideas for new design tools that are necessary for the successful and efficient design
of mixed-signal systems. These tools automate the design of embedded passives, help
with the analysis of EBG structures, and provide a fast electromagnetic analysis of
package interconnections and power delivery networks.

4.1 Introduction
In recent years, the marriage of high-speed computing and wireless communication has
emerged as a formidable driving force in the global electronics industry. This has
resulted in products with both computing and communication capabilities and has
engineered a tremendous surge of interest in the mixed-signal market [1]. Figure 4.1
shows the global mixed-signal market and its composition [2], with communication
products being the major driver, constituting $8.9 billion of the total market.

Other
Consumer $1.5B
$3.3B Communications
$8.9B
Auto
$3.2B Computing
$2.5B

FIGURE 4.1 Mixed-signal market.