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254 Cha pte r F o u r

47. J.-S. Goo, K.-H. Oh, C.-H. Choi, Z. Yu, T. H Lee, and R. W. Dutton, “Guidelines
for the power-constrained design of a CMOS tuned LNA,” Proc. Int. Conference on
Simulation of Semiconductor Processes and Devices (SISPAD), Seattle, WA, September
2000, pp. 269–272.
48. V. Govind, S. Dalmia, and M. Swaminathan, “Design of integrated low noise ampli-
fiers (LNA) using embedded passives in organic substrates,” IEEE Transactions on
Advanced Packaging, vol. 27, February 2004, pp. 79–89.
49. A. Bavisi, V. Sundaram, and M. Swaminathan, “A miniaturized novel feedback LC
oscillator for UMTS type applications in a 3-D stacked liquid crystalline polymer
technology,” Int. Journal RF and Microw. Comp. Aided Engg., Wiley Interscience,
published on-line on February 2006., pp. NA.
50. A. Bavisi, V. Sundaram, and M. Swaminathan, “Design of a system-in-package
based low phase noise VCO using 3-D integrated passives on a multi-layer LCP
substrate,” 35th European Microwave Conf., October 2005.
51. UMA Technology, [on-line document], available at http://www.umatechnology.
org.
52. H. Hashemi, “Integrated Concurrent Multi-band Radios and Multiple Antenna
Systems,” Ph.D. Thesis, California Institute of Technology, Sept. 2003.
53. A. Bavisi, V. Sundaram, M. Swaminathan, S. Dalmia, and G. White, “Design of a
dual frequency oscillator for simultaneous multi-band radio communication on
a multi-layer liquid crystalline polymer substrate,” IEEE Radio Wireless Symp.,
January 2006, pp. 431–434.
54. J. S. Schaffner, “Simultaneous Oscillations in Oscillators,” IRE Tran. Circuit Theory,
vol. 1, no. 2, June 1954, pp. 2–8.
55. Simon Haykin, Neural Networks: A Comprehensive Foundation, 2nd ed., Prentice
Hall, 1998.
55a. Madhavan Swaminathan and A. Ege Engin, Power Integrity Modeling and Design
for Semiconductors and Systems, Prentice Hall, December 2007.
55b. A. E. Engin, W. John, G. Sommer, W. Mathis, and H. Reichl, “Modeling of striplines
between a power and a ground plane,” IEEE Transactions on Advanced Packaging,
vol. 29, no. 3, August 2006, pp. 415–426.
55c. A. E. Engin, K. Bharath, and M. Swaminathan, “Multilayered finite difference
method (M-FDM) for modeling of package and printed circuit board planes,”
IEEE Transactions on Electromagnetic Compatibility, vol. 49, no. 2, May 2007, pages
441–447.
56. Rohan Mandrekar, “Modeling and Co-simulation of Signal Distribution and Power
Delivery in Package Based Systems,” PhD thesis, Georgia Institute of Technology,
May 2006.
57. Kwan Choi, Modeling and Simulation of Embedded Passives Using Rational
Functions in Multi-layered Substrates, PhD thesis, Georgia Institute of Technology,
August 1999.
58. Sung-Hwan Min, “Automated Construction of Macro Models of Distributed
Interconnect Networks,” PhD Thesis, Georgia Institute of Technology, 2004.
59. Jinwoo Choi, “Noise Suppression and Isolation in Mixed-signal Systems Using
Alternating Impedance-electromagnetic Bandgap Structure (AI-EBG),” PhD
thesis, Georgia Institute of Technology, December 2005.
60. http://www.synopsys.com/products/mixedsignal/hspice/hspice.html.
60a. G. Taguchi, Introduction to Quality Engineering. Dearborn, MI: Distributed by
American Supplier Institute, Inc., 1986.