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Mixed-Signal (SOP) Design 251

Acknowledgments
The authors would like to thank Sidharth Dalmia for the section on WLAN Front End
Modules. The authors would also like to acknowledge all the students, engineers, and
visiting scholars of the Epsilon Research Group and Packaging Research Center, Georgia
Tech. In particular, the authors would like to acknowledge the contributions of George
White, Jinwoo Choi, Venky Sundaram, Raj Pulugurtha, Yoshitaka Toyota, Takayuki
Watanabe, Rohan Mandrekar, Krishna Srinivasan, Krishna Bharath, Souvik Mukherjee,
and Prathap Muthana.

References
1. The Electronics Industry Report, Prismark Partners LLC, 2004.
2. World Semiconductor Trade Statistics, http://www.wsts.org.
3. Intel Corporation, http://www.intel.com/labs/features/cn09031.htm.
4. N-Gage, http://www.n-gage.com.
5. H. Hashemi and A. Hajimiri, “Concurrent multiband low-noise amplifiers-theory,
design, and applications”, IEEE Trans. Microw. Theory Tech., vol. 50, no. 1, January
2002, pp. 288–301.
6. V. Govind, S. Dalmia, J. Choi, and M. Swaminathan, “Design and implementation
of RF subsystems with multiple embedded passives in multi-layer organic sub-
strates,” Proceedings of the IEEE Radio and Wireless Conference (RAWCON), Boston,
MA, August 2003, pp. 325–328.
7. S. Wu and B. Razavi, “A 900-MHz/1.8-GHz CMOS receiver for dual-band
applications,” IEEE Journal of Solid-State Circuits, vol. 33, December 1998,
pp. 2178–2185.
8. D. M. Pozar and S. M. Duffy, “A dual-band circularly polarized stacked microstrip
antenna for global positioning satellite,” IEEE Antennas and Propagation, vol. 45,
November 1997, pp. 1618–1625.
9. A. Raghavan, D. Heo, M. Maeng, A. Sutono, K. Lim, and J. Laskar, “A 2.4 GHz
high efficiency SiGe HBT power amplifier with high-Q LTCC harmonic suppres-
sion filter,” IEEE MTT-S International Microwave Symposium Digest, vol. 2, June
2002, pp. 1019–1022.
10. S.–W. Yoon, M. F. Davis, K. Lim, S. Pinel, M. Maeng, C.–H. Lee, S. Chakraborty,
and S. Mekela, “C-band oscillator using high-Q inductors embedded in multi-
layer organic packaging,” IEEE MTT-S International Microwave Symposium Digest,
vol. 2, June 2002, pp. 703–706.
11. A. , S. Dalmia, and M. Swaminathan, “A 3G/WLAN VCO with high Q embed-
ded passives in high performance organic substrate,” Proceedings of the IEEE Asia
Pacific Microwave Conference (APMC), Seoul, S. Korea, November 2003, pp. NA.
12. P. Pieters, K. Vaesen, G. Carchon, S. Brebels, W. de Raedt, E. Beyne, M. Engels, and
I. Bolsens, “Accurate modeling of high-Q spiral inductors in thin-film multilayer
technology for wireless telecommunication applications,” IEEE Transactions on
Microwave Theory and Techniques, vol. 49, April 2001, pp. 589–599.
13. A. L. L. Pun, T. Yeung, J. Lau, F. J. R. Clement, and D. K. Su, “Substrate noise
coupling through planar spiral inductor,” IEEE Journal of Solid-State Circuits, vol. 33,
June 1998, pp. 877–884.