Page 273 - System on Package_ Miniaturization of the Entire System

Copper (36 μm) Signal layer

FR4 (ε r = 4.4, thickness = 5 mils)
Copper (36 μm) Ground layer
FR4 (ε r = 4.4, thickness = 5 mils)
4.02 cm Copper (36 μm) Power layer
LNA FPGA
FR4 (ε r = 4.4, thickness = 5 mils)
10.8 cm
(a) (b)
FIGURE 4.99 (a) Photograph of test vehicle. (b) Cross section.

−30
Solid line : LNA output spectrum for the test
vehicle without AI_EBG structure
−40 Dotted line: LNA output spectrum for the test
vehicle with AI-EBG structure
−50
Noise peaks
Power (dBN) −60
are suppressed

−70

−80

−90
0.00E+00 5.00E+08 1.00E+09 1.50E+09 2.00E+09 2.50E+09 3.00E+09
Frequency (Hz)
(a)
−50
th
−55 Solid line: 7 harmonic
noise peak at LNA
output for mixed-signal
−60
system without AI-EBG
structure
−65
Power (dBN) −70
−75
th
Dotted line: 7 harmonic
−80 noise peak LNA output
for mixed-signal system
−85 with AI-EBG structure
−90
2.09E+09 2.10E+09 2.10E+09 2.10E+09 2.10E+09 2.10E+09 2.11E+09
Frequency (Hz)
(b)

FIGURE 4.100 (a) Comparison of LNA output spectrum with and without AI-EBG. (b) Comparison
of seventh harmonic noise at LNA output.

247