Page 278 - System on Package_ Miniaturization of the Entire System

252 Cha pte r F o u r

14. M. Xu, D. K. Su, D. K. Shaeffer, T. H. Lee, and B. A. Wooley, “Measurement and
modeling the effects of substrate noise on the LNA for a CMOS GPS receiver,”
IEEE Journal of Solid-State Circuits, vol. 36, March 2001, pp. 473–485.
15. N. K. Verghese and D. J. Allstot, “Computer-aided design considerations for
mixed-signal coupling in RF integrated circuits,” IEEE Journal of Solid-State
Circuits, vol. 33, March 1988, pp. 314–323.
16. D. K. Su, M. J. Loinaz, S. Masui, and B. A. Wooley, “Experimental results and
modeling techniques for substrate noise in mixed-signal integrated circuits,” IEEE
Journal of Solid-State Circuits, vol. 28, April 1993, pp. 420–429.
17. T. Liu, J. D. Carothers, and W. T. Holman, “Active substrate coupling noise
reduction method for ICs,” IEEE Electronic Letters, vol. 35, September 1999,
pp. 1633–1634.
18. M. Felder and J. Ganger, “Analysis of ground-bounce induced substrate
noise coupling in a low resistive bulk epitaxial process: Design strategies to
minimize noise effects on a mixed-signal chip,” IEEE Transactions on Circuits
and System—II. Analog and Digital Signal Processing, vol. 46, November 1999,
pp. 1427–1436.
19. R. C. Frye, “Integration and electrical isolation in CMOS mixed-signal wireless
chips,” Proceedings of the IEEE, vol. 89, April 2001, pp. 444–455.
20. M. Nagata, J. Nagai, T. Morie, and A. Iwata, “Measurements and analyses of
substrate noise waveform in mixed-signal IC environment,” IEEE Transactions
on Computer-Aided Design of Integrated Circuits and Systems, vol. 19, June 2000,
pp. 671–678.
21. M Nagata, J. Nagai, K. Hijikata, T. Morie, and A. Iwata, “Physical design guides
for substrate noise reduction in CMOS digital circuits,” IEEE Journal of Solid-State
Circuits, vol. 36, March 2001, pp. 539–549.
22. J. Briaire and K. S. Krisch, “Principles of substrate crosstalk generation in CMOS
circuits,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and
Systems, vol. 19, June 2000, pp. 645–653.
23. J. Mao, “Modeling of Simultaneous Switching Noise in On-Chip and Package
Power Distribution Networks Using Conformal Mapping, Finite Difference
Time Domain and Cavity Resonator Methods”, PhD Dissertation, School
of Electrical and Computer Engineering, Georgia Institute of Technology,
2004.
24. D. C. Thompson, O. Tantot, H. Jallageas, G. E. Ponchak, M. M. Tentezeris, and J.
Papapolymerou, “Characterization of liquid crystal polymer (LCP) material and
transmission lines on LCP substrates from 30 to 110 GHz,” IEEE Trans. Microwave
Theory and Tech., vol. 52, April 2004, pp. 1343–1352.
25. http://www.skyworksinc.com/products_detailpop2.asp?pid=8723, March
2006.
26. http://www.coilcraft.com/prod_rf.cfm, March 2006.
27. W. Yun, A.Bavisi, V. Sundaram, M. Swaminathan, and E. Engin, “3D integration
and characterization of high Q passives on multilayer LCP substrate,” IEEE Asia
Pacific Microw. Conf., December 2005, pp. 327–330.
28. http://www.sonnetusa.com.
29. A. Bavisi, V. Sundaram, M. Swaminathan, S. Dalmia, and G. White, “Design of a
dual frequency oscillator for simultaneous multi-band radio communication on
a multi-layer liquid crystalline polymer substrate,” IEEE Radio Wireless Symp.,
January 2006, pp. 431–434.