Page 272 - MEMS Mechanical Sensors

Index 261

Analyzer, 44, 45–47 adhesive, 63
Architect, 44 eutectic bonding, 64
AutoSpring, 46 glass, 64
bundles, 44 method comparison, 64
CoSolveEM, 45 soldering, 63
defined, 44 See also Packaging
Designer, 44–45 Differential pressure sensors, 121
Integrator, 44, 47 Direct chip attach (DCA). See Flip chip
MemCap, 45 Doped silicon, 17
MemDamping, 46 Dosing systems, 214
MemETherm, 46 Double-axis gyroscopes, 203–4
MemHenry, 46 Double-ended tuning fork (DETF), 101
MemMech, 45 Double-sided lithography, 18
MemPackage, 46 Drag force flow sensors, 232–35
MemPZR, 46 data, 235
MemTrans, 47 defined, 232
SimMan, 46 disadvantages, 235
Solid Model tool, 45 in-plane, 233
See also Finite element simulation tools out-of-plane, 233
Crystalline silicon, 4–5 wind receptor hair, 234
diamond structure, 7–8 See also Force transfer flow sensors
wafers, 5 DRIE, 27
See also Silicon (Si) Druck resonant pressure sensor, 140
Dry etching, 21–22
D anisotropic, 27–28
isotropic, 27
DampingMM, 47 See also Etching
Deposition, 12–17
Dual-axis gyroscopes, 203–4
amorphous silicon, 13
chemical vapor (CVD), 13 defined, 203
epitaxy, 14 illustrated, 203
implementation, 203–4
FIB, 36
See also Gyroscopes
illustrated, 12
metals, 17 Dynamic pressure, 116
polysilicon, 13 sensing, 120–21
sensor response, 120
silicon dioxide, 15–17
silicon nitride, 14–15
thermal growth, 12–13 E
Diaphragm-based pressure sensors, 123–30 Electret microphones, 144
Diaphragms Electrical interconnects, 60–63
bossed, 128–29 flip chip, 61–63
corrugated, 129 tape automated bonding, 61
defined, 123 wafer level packages, 68–70
edge conditions, 136 wire bonding, 60–61
flat, 136 Electric power-assisted steering (EPAS)
medium deflection, 127 systems, 159
metal, 124 Electrochemical etching, 35
rigidly clamped, 124 Electrochemical etch stop, 35–36
simply-supported, 125 process, 35
small deflection, 125–27 setup, 36
stepped, 136 See also Fabrication
transduction mechanisms, 129–30 Electrochemical flow sensors, 240–41
Die attachment, 63–64 data, 241