Page 273 - MEMS Mechanical Sensors

262 Index

Electrochemical flow sensors (continued) advantages, 62
for impedance measurement, 241 bonding cross-section, 62
schematic cross-section, 241 defined, 61
Electroplating, 33–34 disadvantages, 62
defined, 33 See also Packaging
illustrated, 34 Flow
process, 33–34 laminar, 215
Electrostatic bonding. See Anodic bonding measurement principles, 213
Epitaxy, 14 profiles, 216
Etching, 21–28 turbulent, 215, 247–48
deep, 22 Flow imaging, 243–45
dry, 21–22 data for, 244
dry anisotropic, 27–28 use of, 243–44
dry isotropic, 27 Flow sensors, 213–50
electrochemical, 35 anemometers, 219–20
FIB, 36 bubbles and, 216
illustrated, 12 drivers, 214
KOH, 22 Faraday principle, 241–42
types of, 22 force transfer, 232–39
wet, 21 MEMS to NEMS, 250
wet anisotropic, 22–27 micro, 214–17
wet isotropic, 22 in microchannels, 215
Eutectic bonding, 31, 64 nonthermal time of flight, 239–41
optical, 245–47
F packaging, 249
with periodic flapping motion, 242–43
Fabrication, 11–36 pressure difference, 229–32
bossed diaphragms, 131
thermal, 217–29
deposition, 12–17
electrochemical etch stop, 35–36 time of flight, 223–25
electroplating, 33–34 Focused ion beam (FIB) technology, 36
Force balance, 143
etching, 21–28
Force sensors
FIB technology, 36
LIGA, 34 capacitive, 161
lithography, 17–21 load cells as, 156, 157
piezoresistive, 156
porous silicon, 35
PZT, 164
surface micromachining, 28–29
thick-film screen printing, 32–33 surface-machined, 157
wafer bonding, 29–32 variable gap capacitor, 161
Finite element modeling (FEM), 39–40 See also Torque sensors
Force transfer flow sensors, 232–39
Finite element simulation tools, 43–56
ANSYS, 50–54 Coriolis force, 236–38
CoventorWare, 44–47 drag force, 232–35
lift force, 235–36
defined, 43–44 static turbine flow meter, 238–39
IntelliSuite, 48–50
MEMS Pro/MEMS Xplorer, 54–55 See also Flow sensors
See also Simulation tools Frequency, 96–97
First order packaging, 67
defined, 67 G
pressure sensor, 73 Gauge pressure sensors, 121
stage, 73–74 Glass die attach, 64
See also Packaging Glasses, 10–11
Flip chip, 61–63 Grayscale lithography, 18–19