Page 360 - A Practical Guide from Design Planning to Manufacturing

330 Chapter Ten

5. What are the advantages of flip-chip packages compared to wire-
bond packages?
6. What are the three most common lead configurations?
7. How can using an MCM package reduce costs?
8. What factors affect the thermal resistance of a processor?
9. [Lab] Looking at a PC motherboard identify as many packaging
types as possible.
10. [Bonus] Assuming an ambient temperature of 40°C and a maximum
allowed on die temperature of 100°C, what is the thermal power
limit for a processor in a packaging giving a total thermal resistance
of 0.5°C/W? What is this limit for a thermal resistance of 3°C/W?

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