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APPLICATIONS                               4 MICROELECTRONICS PACKAGING BY METAL NANOPARTICLE PASTES
                    Attention has also been paid to the SERS sensor in  [3] A.E. Neeves, M.H. Birnboim: J. Opt. Soc. Am. B, 6,
                  recent years.  The sensor provides information of  787–796 (1989).
                  vibration and rotation in a molecule, so that details in  [4] J. Homola, S.S. Yee and G. Gauglitz: Sens. Actuators
                  molecular structures are available. The SERS spec-  B, 54, 3–15 (1999).
                  troscopy was found in the 1970s, and many studies  [5] B. Liedberg, K. Johansen:  Affinity Biosensing
                  have revealed that the origin of the large enhancement  Based on Surface Plasmon Resonance Detection, in:
                  is attributed to two reasons [9]: one is the main reason  K.R. Rogers,  A. Mulchandani (eds.).  Affinity
                  that a large electric field is produced in a rough silver
                  surface and the other is an additional reason that  Biosensors  Techniques and Protocols, Humana
                  enlarged molecular vibration upon adsorption of mol-  Press, Totowa, NJ, pp. 31–54 (1998).
                  ecules on a silver surface. Recently a huge enhance-  [6] K. Kajikawa:  Protein Nucleic  Acid Enzyme,  49,
                  ment of the SERS signal has been found in a system  1772–1776 (2004) (in Japanese).
                  of aggregated silver nanoparticles, and Raman spec-  [7] Y. Okahata, H. Furusawa:  Protein Nucleic  Acid
                  troscopy from a single molecule has been reported  Enzyme, 49, 1754–1758 (2004) (in Japanese).
                  [10–12]. Substrates that provide a large SERS signal  [8] K. Mitsui, Y. Handa and K. Kajikawa:  Appl. Phys.
                  have been developed [13]. These efforts enable us to  Lett., 85, 4231–4233 (2004).
                  perform Raman spectroscopy without using special  [9] K. Kneipp, H. Kneipp, I. Itzkan, R.R. Dasari and
                  techniques. Also portable Raman systems have been  M.S. Field: Chem. Rev., 99, 2957–2975 (1999).
                  reported [14, 15].
                    In summery, LPR in metallic nanoparticles provides  [10] S. Nie, S.R. Emory: Science, 275, 1102–1106 (1997).
                  many potential applications for optical sensors.  The  [11] H. Yu, E.J. Bjereld, M. Kaell and L. Borjesson: Phys.
                  fields are wide, such as chemistry, biology, medical,  Rev. Lett., 83, 4357–4360 (1999).
                  genome engineering, materials science, and electronics.  [12] Y. Maruyama, M. Ishikawa and M. Futamata: J. Phys.
                                                                     Chem. B, 108, 673–678 (2004).
                                                                 [13] N. Hashimoto, N. Ishikawa and A. Nakajima: Chem.
                                   References
                                                                     Phys. Lett., 413, 78–83 (2005).
                   [1] C.F. Bohren, D.R. Huffman:  Absorption and  [14] A.J. Sommer, S.A. Stewart:  Appl. Spectrosc.,  53,
                      Scattering of Light by Small Particles, Wiley,  New  483–488 (1999).
                      York, pp. 335–380 (1983).                  [15] M.A.  Young, D.A. Stuart, O. Lyandres, M.R.
                   [2] M. Fukui, M. Ohtsu: Hikarinanotekunoroginokiso,  Glucksberg and R.P. Van Duyne: Can. J. Chem., 82,
                      Ohmsha Ltd., pp. 69–105 (2003) (in Japanese).  1435–1441 (2004).


                            APPLICATION 4
                    4       MICROELECTRONICS PACKAGING BY METAL NANOPARTICLE PASTES






                  1. Conductive paste technique and metal        conductive metallic thin film. However, the firing
                  nanoparticle paste                             temperature of the conventional conductive pastes is
                                                                 over 550 C, limiting the usage of the pastes to the
                  In the field of microelectronics packaging, conduc-  glass and ceramics substrates.
                  tive paste technique is usually used for the forma-  On the other hand, much attention has been paid
                  tion of various electronic components such as  to metal nanoparticle pastes including metal
                  conductive circuits, electrodes, resistors, and  nanoparticles with several nanometer to dozens of
                  dielectrics. Conventional technique of conductive  nanometer size as a new technology available for
                  pastes is mainly thick film pastes composed of  down-sizing and flexibility of the electronic compo-
                  metal powders with several micrometers to submi-  nents. Decreasing the diameter of metal particle, the
                  crometer size and organic compounds. Using con-  surface energy increases to become unstable com-
                  ductive pastes, the electronic circuit patterns are  pared with the bulk metal. Usually, metal nanoparti-
                  figured on a substrate by screen printing or dispens-  cles prepared by various methods are capped by
                  ing method, and so on, and then dried and fired to  organic protecting groups to control the growth of the
                  decompose the pastes and to remove organic addi-  particles and the particle size [1, 2]. Fig. 4.1 shows the
                  tives such as dispersants and coherence agents. As a  transmission electron microscope (TEM) photograph
                  result, metal particles are melted and fused to afford  of gold nanoparticles prepared by gas evaporation

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