Page 333 - Organic Electronics in Sensors and Biotechnology
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310    Cha pte r  Ei g h t




                   n                n                             n
                                                   n
                                                               OH
                                             O     O
                                                           PVA
                                              PMMA
                               PS
                OH
               PVP
                                                             OR
                                                  O             O
                          F    F
                            H     H          n       RO              O
                   n
                Cl        F   n    m                        RO    OR  n
                            H     H                  R = CH CH CN
                                                           2
                                                              2
              PVC
                         P(VDF-TrFE)                    CYEPL
                                         PαMS
                                    Si
                                               H            H
                         Si  Si                 2            2
             Si            O                   C            C
                                                              n
                                                  Parelyne N
                          BCB

          FIGURE 8.6  Chemical structure of some commonly used electroactive polymer
          dielectrics. PVP: poly(4-vinyl phenol); PS: polystyrene; PMMA: polymethyl-
          methacrylate; PVA: polyvinyl alcohol; PVC: polyvinylchloride; P(VDF-TrFE):
          poly(vinylidene fl uoride-trifl uoro-ethylene); PαMS: poly[α-methylstyrene], CYEPL:
          cyano-ethylpullulan, BCB: divinyltetramethyldisiloxane-bis(benzocyclobutene) and
          parylene N.


                   A large variety of polymeric dielectrics have been investigated for
               their use in OFETs. Their chemical structures are shown in Fig. 8.6. For
               example, polyimides are commonly used as dielectric materials in
               flexible pressure sensors 57, 58  and circuitry.  Divinyltetramethyldisiloxane-
                                                 59
               bis(benzocyclobutene) (BCB), another type of spin-on dielectric broadly
               used in the microelectronics industry, is used for high-performance tran-
                               20
               sistors and circuits.  Poly(vinylphenol) is used in the fabrication of all-
               polymer logic circuits.  Poly(vinyl alcohol) (PVA) is used as an electret
                                 60
               in electret field-effects transistors (EFETs). 61, 62  Poly(dimethylsiloxane)
               (PDMS) is well known to form “PDMS stamps” which allow one to
               make conformal contact with organic semiconductors using deposition
               methods for dielectric layers that may cause degradation of the organic
                            63
               semiconductor.  Photocurable organic polymeric dielectrics such as thin
               films of poly(4-vinylphenol) (PVP) can be patternable and printable
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