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TIPS FOR USING A SOLDERLESS BREADBOARD 413

Tips for Using a Solderless Breadboard

Here are some tips for solderless breadboard success:
• When using static- sensitive components like CMOS integrated circuits or MOSFET transis-
tors, build the rest of the circuit first, using “dummy” parts to make sure you wire every-
thing properly. When you are ready to test the circuit, remove the dummy chip and replace
it with the CMOS parts.
• When inserting wire, use a small needle- nose pliers (no serrated jaws please) to plug the
end of the wire into the contact hole. Use the pliers to gently pull it out of the hole when
you are done with the breadboard.
• Never expose a breadboard to high heat, or the plastic could be permanently damaged. ICs
and other components that become very hot (because of a short circuit or excess current,
for example) may melt the plastic underneath them. Check the temperature of all compo-
nents while the circuit is under power.
• Use a chip inserter and extractor to implant and remove ICs. This reduces the chance of
damaging the IC during handling.
• Avoid building a bird’s nest, where the connection wires are routed carelessly. This makes
it harder to debug the circuit and it greatly increases the chance of mistakes.
• Remember! Solderless breadboards are designed for low- voltage DC circuits only. They
are not designed, nor are they safe, for carrying AC house current.

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