Page 207 - Semiconductor Manufacturing Handbook

Geng(SMH)_CH14.qxd 04/04/2005 19:52 Page 14.8

CHEMICAL VAPOR DEPOSITION

1.4 1.4

1.2 1.2

1 1

0.8 0.8
Y (µm) Y (µm)
0.6 0.6

0.4 0.4

0.2 0.2

0 0
−0.3 −0.2 −0.1 0 0.1 0.2 0.3 −0.3 −0.2 −0.1 0 0.1 0.2 0.3
X (µm) X (µm)
Sticking coefficient = 1, Sticking coefficient = 0.1,
Bottom coverage = 8% Bottom coverage = 25%
(a) (b)

1.4 1.4

1.2 1.2

1 1

0.8 0.8
Y (µm) Y (µm)

0.6 0.6

0.4 0.4

0.2 0.2

0 0
−0.3 −0.2 −0.1 0 0.1 0.2 0.3 −0.3 −0.2 −0.1 0 0.1 0.2 0.3
X (µm) X (µm)
Sticking coefficient = 0.01, Sticking coefficient = 0.001,
Bottom coverage = 58% Bottom coverage = 100%
(c) (d)
FIGURE 14.5 Effect of sticking coefficient on step coverage in a 4:1 aspect ratio trench.

14.8
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