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ECD FUNDAMENTALS

16.10 WAFER PROCESSING

submicron features. ECD prevents void formation in the deposition process by combining organic
additives and electrolytic deposition parameters to produce high-yielding, reliable interconnects. To
maintain consistent performance, the plating bath is periodically analyzed and replenished with auto-
mated chemical management systems. Semiconductor manufacturers are now researching methods
to further reduce line resistance as features continue to shrink. These include switching to thinner
and more conductive ALD barrier materials. Electromigration lifetimes and dielectric constants may
be further improved with selectively deposited electroless capping layers.

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