Page 147 - Microsensors, MEMS and Smart Devices - Gardner Varadhan and Awadelkarim
P. 147

ETCH-STOP TECHNIQUES     127















     Figure 5.9  Electrochemical cell with 5 percent HF solution to etch silicon. The voltage  V a applied
     to the  silicon  is relative to  a platinum reference  electrode

                                                       .0Q.crn(p)


                      £  0.3 -
                                                     0.01 Q .cm (n)
                        0.2 -


                      §  0.1 h
                      U                               0.3Q«cm(/i)

                                  5        10      15
                                       Voltage  V a (v)

     Figure  5.10  Plot  of electrochemical  current density  against  voltage  for  silicon  doped  to different
     resistivities

       To understand  the mechanisms  of electrochemical etch-stop,  it is  important  to  explore
     in  more  detail  the current-voltage  (/-  V)  characteristics  in etching  solutions  that exhibit
     strong  electrochemical  etch-stop  effects.  The  curves  in  Figure  5.11  are  typically  (I-V)
     characteristics  for  n-  and  p-type  silicon  in  KOH.  We  can  easily  see  the  similarity  of
     Figure  5.11  to  the  well-known  curve  of  a  diode,  except  that  at  a  certain  voltage  the
     current  suddenly and  sharply  drops.  Let  us define  the  open  circuit potential  (OCP)  as the
     potential  at which the current /  is zero, and the passivating potential  (PP)  as the potential
     at which the current suddenly drops from  its maximum value. The two regions  of interest
     are the  ones  separated  by  the  PP.  Only cathodic  to the  PP is  the  sample  etched,  whereas
     just  anodic  to it,  an oxide grows and the  surface is passivated.  The insulating oxide layer
     that  is  formed  during  the  etching  process  brings  about  the  drastic  fall  in  current at  the
     PP. The  difference  between  this  etch  and  the  HF etch  described  in  Figure  5.9  is  the  fact
     that  in  the  latter  etch  the  oxide  is  dissolved  by  the  HF  solution,  whereas  in  the  former
     etch  the oxide is  not readily  dissolved  in the  KOH solution. Another important feature of
     Figure  5.11  is the  different behaviour  of  the two dopant  types.  When  applying  a  voltage
     between  the  two  passivating  potentials  of  n-  and  p-type,  one  expects,  in  accordance
     with  the  characteristics  shown in  Figure 5.11,  that only  the  p-type  sample,  and  not  the
     n-type  sample,  would be  etched.  This  is  the  doping-selective  effect  that  is  used  as  an
     etch-stop.
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