Page 78 - Rashid, Power Electronics Handbook
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                                                                                                          Godoy
                                                                                                       M.
               64
               64                                                                                      M. Godoy Simo˜es s
                                                                                                                    ˜e
                     1 Mhz                                                1 Mhz
                            Power                                        100 kHz   Power
                                                                                   MOSFET
                   Frequency  10 kHz  IGBT  BJT                         Frequency  10 kHz  MCT
                           MOSFET
                    100 kHz
                             MCT                                                IGBT   BJT
                      1 kHz                                               1 kHz
                                         GT O                                           GT O
                                               T hyristor                                   T hyristor
                                 1 kV    2 kV   3 kV    4 kV    5 kV                    1 kA       2 kA      3 kA
                                            Voltage                                          Current
                                          (a)                                              (b)


                            FIGURE 5.1  Power semiconductor operating regions. (a) voltage vs frequency; and (b) current vs frequency.




               bipolar power transistor to achieve the same drive perfor-  5.2 Basic Structure and Operation
               mance. Additionally, the MOSFET gate has high input capa-
               citance, which places the same requirements on the gate-drive  The bipolar junction transistor (BJT) consists of a three-region
               circuitry as the IGBT employed at that stage. The IGBTs
                                                                    structure of n-type and p-type semiconductor materials; it can
               outperform MOSFETs when it comes to conduction loss vs
                                                                    be constructed as npn as well as pnp. Figure 5.2 shows the
               supply-voltage rating. The saturation voltage of MOSFETs is
                                                                    physical structure of a planar npn bipolar junction transistor.
               considerably higher and less stable over temperature than that
                                                                    The operation is closely related to that of a junction diode
               of IGBTs. For these reasons, the insulated-gate bipolar tran-
                                                                    where in normal conditions the pn junction between the base
               sistor took the place of bipolar junction transistors in several  and collector is forward-biased ðv BE  > 0Þ, causing electrons to
               applications during the 1980s. Although the IGBT is a cross  be injected from the emitter into the base. As the base region is
               between the bipolar and MOSFET transistor, with the output  thin, the electrons travel across it and arrive at the reverse-
               switching and conduction characteristics of a bipolar transis-  biased base-collector junction ðv BC  < 0Þ, where there is an
               tor, but voltage-controlled like a MOSFET, the early IGBT  electric ®eld (depletion region). Upon arrival at this junction
               versions were prone to latch up, which had been largely  the electrons are pulled across the depletion region and drawn
               eliminated by the 1980s. Another characteristic with some  into the collector. These electrons ¯ow through the collector
               IGBT types is the negative temperature coef®cient, which can  region and out the collector contact. Because electrons are
               lead to thermal runaway and makes the paralleling of devices  negative carriers, their motion constitutes positive current
               hard to achieve. Currently, this problem is being addressed in  ¯owing into the external collector terminal. Even though the
               the latest generations of IGBTs.                     forward-biased base-emitter junction injects holes from base
                 It is very clear that a categorization based on voltage and  to emitter, the holes do not contribute to the collector current
               switching frequency provides two key parameters for deter-  but result in a net current ¯ow component into the base from
               mining whether a MOSFET or an IGBT is the better device in  the external base terminal. Therefore, the emitter current is
               an application. However, there are still dif®culties in selecting  composed of these two components: electrons destined to be
               a component for use in the crossover region, which includes
               voltages of 250 to 1000 V and frequencies of 20 to 100 kHz. At                   v CE
               voltages <500 V, the BJT has been entirely replaced by                       _  +   _  +
               MOSFET in power applications and has also been displaced      Forward-biased                 Reverse-biased
                                                                             junction
               at higher voltages, where new designs use IGBTs. Most regular               i E    i B    i C  junction
               industrial needs are in the range of 1–2 kV blocking voltages,               v BE
               200–500 ampere conduction currents, and with switching               Emitter      Base   Collector
               speeds of 10–100 ns. Although in the last few years, new       N    P   N       holes
               high voltage projects displaced BJTs towards IGBT, and it is                    flow
               expected that there will be a decline in the number of new        electrons
               power system designs that incorporate bipolar junction tran-      injection
               sistors, some applications for BJTs remain; in addition the
               huge built-up history of equipment installed in industries
               makes the bipolar junction transistor a good device.    FIGURE 5.2  Structure of a planar bipolar junction transistor.
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