Page 264 - Semiconductor For Micro- and Nanotechnology An Introduction For Engineers
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Electron-Phonon
                                                         1
                                                  µ ∝
                                                   ij
                                                       m ∗ )
                                                       ( ----------------- a      (7.68)
                                                         ij
                                              a
                             where the exponent   depends on the scattering mechanisms that are
                             considered. The point here is that if the band’s curvature changes, as is
                             illustrated in Figure 7.6, then so does the effective mass due to the
                    a)        k  z        b)        k z        c)         k z
                                    k                    k                     k
                                    y                     y                     y


                                        k x                   k  x                  k x




                Figure 7.6.  The conduction band minima of silicon are ellipsoidal in shape and lie along
                the “k” axes. a) Reference state. b) Hydrostatic stress causes the minima to equally
                decrease in size. c) Uniaxial stress along the x-axis has no appreciable effect on the con-
                duction band minima of the y and z axes. The figures are not to scale.



                             change in curvature. Hence we also expect the mobility and the carrier
                             conductivities to change. In addition, depending on the direction of the
                             stress, the conductivity can change from an effectively isotropic value to
                             an anisotropic tensor. This is the basis of the piezoresistive effect, and is
                             exploited in piezoresistors, as shown for the integrated pressure sensor of
                             Figure 7.7. Whereas piezoresistors are useful, there is also a parasitic
                             effect. Electronic packaging can cause resistance changes within the chip
                             due to package stress, and special measures must be taken to reduce this
                             effect, including the addition of extra circuitry in the case of sensor
                             devices. When the crystal deformation is linear, we can write the piezore-
                             sistive effect as a tensor equation







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