Page 98 - Wire Bonding in Microelectronics

Bonding W ir e Metallur gy and Characteristics 77

3-7 Dirks, A. G., Wierenga, P. E., and van den Broek, J. J., “Ultramicrohardness of
Aluminum and Aluminum Alloy Thin Films,” Thin Solid Films, Vol. 172, 1989,
pp. 51–60.
3-8 Bangeri, H., Kaminitschek A., and Wagendristel, A., “Ultramicrohardness
Measurements On Aluminum Films Evaporated under Various Conditions”,
Thin Solid Films, Vol. 137, 1986, pp. 193–198.
3-9 Nabatian, D, & Nguyen, P. H., “The Effect of Mechanical Properties of Thick
Film Inks on Their Ultrasonic Bondability,” Proc. of ISHM, Atlanta, GA, 1986
pp. 65-71.
3-10 Klein, H. P., Durmutz, U, Pauthner, H., and Rohrich, “Aluminum Bond Pad
Requirements for Reliable Wirebonds,” Proc. IPFA Symposium, Nov. 7–9,
Singapore, 1989, pp. 44–49.
3-11 Hirota, J., Machida, K., Okuda, T., Shimotomai, M., and Kawanaka, R., “The
Development of Copper Wire Bonding for Plastic Molded Semiconductor
Packages,” 35th Proc. IEEE Electronic Components Conference, Washington, D.C.,
May 20–22, 1985, pp. 116–121.
3-12 Dreibelbiss, J., Kulicke & Soffa Co. The first production test was in March 1984
at a facility in Bangkok. Private Communication, Lee Levine.
3-13 Huang, L. J., Jog, M. A., Cohen, I. M., and Ayyaswamy, P. S., “Effect of Polarity
on Heat Transfer in the Ball Formation Process,” J. Elect. Materials, Vol. 113,
Mar. 1991, pp. 147–153. Also see same authors, “Ball Formation in Wire
Bonding”, Part II “Real Scale Experimental Studies,” ISHM Journal, Vol. 13,
June 1990, pp. 29–34.
3-14 Douglas, P., and Davies, G., American Fine Wire Company, Technical Report
#9. This series of reports, #1-9, also show grain structure of wires and give
considerable other technical information.
3-15 Ravi, K. V., and Philofsky, E. M., “Reliability Improvement of Wire Bonds
Subjected to Fatigue Stresses,” 10th Annual Proc. IEEE Reliability Physics
Symposium, Las Vegas, Nevada, Apr. 5–7, 1972, pp. 143–149.
3-16 Uebbing, J., “Mechanisms of Temperature Cycle Failure in Encapsulated
Optoelectronic Devices,” Proc. IRPS, 1981, pp. 149–156.
3-17 Maguire, D,, Livesay, B. R., and Srivatsan, T. S., “The Effect of Humidity and
Electric Current on the Fatigue Behavior of Aluminum Bonded Wire,” Proc.
ISTFA, Long Beach, CA, Oct. 21–23, 1985, pp. 372-377.
3-18 Tomimuro, H., Jyumonji, H., “Novel Reliability Test Method for Ribbon of
Interconnections Between MIC Substrates,” Proc. 1986 ECC, May 5–7, 1986,
pp. 324–330.
3-19 Onuki, J., Koizumi, M., and Suzuki, H., “Investigation on Enhancement of
Copper Ball Bonds During Thermal Cycle Testing,” IEEE Trans. on CHMT,
Vol. 14, June 1991, pp. 392–395. Also see J. Appl Phys, Vol. 68, 1990, p. 5610.
3-20 Deyhim, A., Yost, B., Lii, M., and Li, C-Y., “Characterization of the Fatigue
Properties of Bonding Wires,” Proc. 1996 ECTC, Orlando FL, May 28–31, 1996,
pp. 836–841.
3-21 Srikanth, N., Murali, S., Wong, Y.M., Vath III, C. J.,” Critical study of ther-
mosonic copper ball bonding”, Thin Solid Films , Vol. 462–463, 2004, 339–345.
3-22 Otto, Alex J., “Insulated Aluminum Bonding Wire For High Lead Count
Packages,” ISHM Journal, Vol. 9, No-1, 1986, pp 1–8.
3-23 Susumu Okikawa, Michio Tanimoto, Hiroshi, Watanabe, Hiroshi, Mikino, and
Tsuyoshi Kaneda, “Development of a Coated Wire Bonding Technology,” IEEE
Trans. Comp. Hybrids and Manuf. Tech. Vol. 12, No. 4, 1989, pp 603–608.
3-24 Christopher Carr, Juan Munar, William Crockett, Robert Lyn, “Robust
Wirebonding of X-Wire Insulated Bonding Wire Technology,” Proc. IMAPS
Symposium, 2007, pp. 911–917.
3-25 Kessler, H. K.,National Bureau of Standards Special Publication 400-
1, Semiconductor Measurement Technology: (March 1974) Burn-out
Characteristics of Fine Bonding Wire, pp. 35-39.
3-26 Loh, E., “Physical Analysis of Data on Fused-Open Bond Wires,” IEEE Trans.
on CHMT, Vol. CHMT-6, No. 2, June 1983, pp. 209–217.
3-27 Loh, E., “Heat Transfer of Fine-Wire Fuse,” IEEE Trans. on CHMT, Vol. CHMT-
7, No. 3, Sept. 1984, pp. 264–267.