Page 99 - Wire Bonding in Microelectronics

78 Cha pte r T h ree

3-28 Coxon, M., Kershner, C,. and McEligot, D. M., “Transient Current Capacities
of Bond Wires in Hybrid Microcircuits,” IEEE Trans. CHMT, Vol. CHMT-9, No.
3, Sept. 1986, pp. 279–285.
3-29 King, R., Schaick, C. V., and Lusk, J., “Electrical Overstress of Nonencapsulated
Aluminum Bond Wires,” 27th Annual Proc., Reliability Physics, Phoenix,
Arizona, Apr. 11–13, 1989, pp. 141–151.
3-30 May, J. T., Gordon, M. L., Piwnica, W. M., and Bray, S. B., “The DC Fusing
Current and Safe Operating Current of Microelectronic Bonding Wires,” Proc.
Intl. Society for Testing and Failure Analysis (ISTFA), Los Angeles, CA, Nov. 6–10,
1989, pp. 121–131.
3-31 Ham, R. E., “Prediction of Bond Wire Temperatures Using an Electronic Circuit
Analogy,” Hybrid Circuit Technology, Ap, 1990, pp. 53–54.
3-32 The military standard, MIL-M-3851O J, 15 Nov. 1991. has a section on current
carrying capacity wire burnout. It is Internal Lead Wires, Paragraph 3.5.5.3. The
simplified formula is not entirely correct, but it can be a general guide.
3-33 Lage, J. (Faculty Advisor), Design of an Apparatus and Test Procedure for the
Fusing Current of Gold Wire in Bare and Encapsulated Condition, Southern
Methodist University, ME Dept., CME 4381—senior Design (sponsored by
Texas Instruments-Semiconductor Group), Apr. 29, 1993 pp. 1–124.
3-34 Fitzsimmons, Ray, Raytheon Company, Private communication.
3-35 Mertol, A., “Estimation of Gold Bond Wire Fusing Current and Fusing Time,”
IEEE Trans. on CPMT-Part B, Vol. 18, No. 1, Feb. 1995, pp. 210–214.
3-36 Rainal, A. J., “Current Carrying Capacity of Fine-Line Printed Conductors,”
Bell System Tech J., Vol. 60, Sept. 1981, pp. 1375–1389. Also see, “Temperature
Rise at a Constriction in a Current-Carrying Printed Conductor,” ibid.,
Vol. 55, Feb. 1976, pp. 233–269.
3-37 IPC Guidelines for Multichip Module Technology Utilization, IPC-MC-790,
Aug. 1992, p. 47.
3-38 Pan, T-Y., Poulson, R. H., and Blair, H. D., “Current Carrying Capacity of
Copper Conductors in Printed Wiring Boards,” Proc. 43rd IEEE Electronics
Components and Tech. Conf., Orlando, FL, June 1–4, 1993, pp. 1061–1066.