Page 195 - Applied Process Design For Chemical And Petrochemical Plants Volume II
P. 195

184                      Applied Process Design for Chemical and Petrochemical Plants

          venting liquid from passing through the holes and bypass-   using the given volumetric weeping liquid rate, and
          ing the overflow weir and downcomer.                        total hole area.
            This point is  generally considered the lower point  of   (d) Calculate  J&
          operation for the tray while maintaining acceptable effi-   JE1/2  + m JE1/2  = C                 (8-273)
          ciency. Some systems are known to operate at only slight
          reduction  in  efficiency while  vapor  velocities  are  well   JE=C
          below the weep point values. It is impossible to predict this
          behavior at present. Weeping is usually the limiting condi-   (e) Calculate vapor rate, VG, based on value of J*G in
          tion in design for low vapor rate, high liquid rate systems.   (d) above using:
          Some factors affecting the weep point of  any system are
          described in the following sections.                                                              (8 - 274)
            Weeping and dumping are types of drainage that occur
          during tray operation, and are more sensitive in the opera-
          tion/control of sieve trays than for valve or bubble cap trays.   (f) Using V,  from  (e) above based on superficial gas
                                                                                                 on
                                                                                          based
          Lessi [194] presents an analysis of these conditions. Weep   rate  calculate VG,~~~~ total  perforated
          ing  simply  means  that  the  gas/vapor  volume  passing   hole area only, ft/sec. That is:
          upward through the tray is not sufficient to prevent liquid   ft3/sec vapor - (vc, ft/sec)  (AH, ft2)
          on  the  tray from running back  down  to  the  tray below,
          thereby affecting the tray efficiencies. Dumping is  a term   The weep point for sieve or valve trays is the vapor rate
          more associated with sieve trays than the others; however, in   at which the liquid weeping rate is diminished to zero.
          concept it represents a large or excessive amount of liquid   Thus,  J*L  approaches zero asJ*G is increased [210]. For a
          draining off  the tray, greater than weeping, and could be   vapor rate that leads to J*G higher than the weep point
          considered a type or forerunner of flooding of the column.   value, then there should be no weeping.
            Hsieh and McNulty [210] developed a new correlation   Windm > 0, for no weeping
          for weeping of sieve and valve trays based on experimental
          research and published data. For sieve trays the estimation   Windex = J*G  - J*~(wee~ pt.)
          of the weeping rate and weep point is recommended using
          a two-phase countercurrent flow limitation model, CCFL.   The higher the value  of Windex,  the more confidence
            The  procedure  [210]  for  weeping  calculation  and   that there will be no weeping [210]. At a constant weep
          determination  of  vapor rate that will result in a certain   point,  J*G  then, the higher the percentage opening of the
          weeping rate  (used by permission, Reference 210 Chemi-   tray,  and  the  higher  will  be  the  vapor  volumetric flow
          cal Engr: Progress, all rights reserved) :            required to satisfy the weep point criteria.
                                                                  To calculate the weep point, useJ*G = 0.74 and calculate
            (a) Calculate Z                                     Z from (a) above, then calculate VG from (e) above.
                                                                  The author’s [210] report that the test results show that
          z = h,1.5/12  ~H0.j                          (8 - 271)
                                                                below the weep  point for  the  Type-T and TypeA valve
            (b) Use values of m and C as determined by Reference   trays, a consistently low weeping rate can be maintained,
                210                                             while for sieve trays the weeping rate increases rapidly at
                For sieve trays                                 low gas flow. For similar operating conditions, the weeping
                                                                rate for a valve  tray can be an order of magnitude lower
                m = 2.01                                        than the corresponding weeping rate for a sieve tray with
                C = 0.74
                                                                the same open area. The tests assume uniform weeping
                For type T-valve style (Koch)                   across  the  entire  tray  deck; however, recent  tests  [210]
                                                                indicate that for a larger &ft diameter  (versus 3ft) tray,
                m = 2.87
                C = 0.74                                        weeping occurs preferentially along the periphery of  the
                                                                bubbling area, indicating that for the larger diameter the
                For type A-valve style (Koch)                   actual weeping rate can be lower by more than 30% when
                m = 2.01                                        referenced to the present models prediction.
                C = 0.74                                          The equivalent hole diameter for use in the equation
                                                                for Z when considering the two types of valve trays studied
             (c) Calculate J*L                                  here is given by:

                                                       (8 - 272)   Dm = 2 [1/(2.331)  (Fp + F3)  (R~)ll’~,   (8-275)
                                                                      (equivalent hole diameter, in.), see Equation 8-277
   190   191   192   193   194   195   196   197   198   199   200