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Amplifier Design



            194  Chapter Three

                        may not be the same width as the MMIC lead itself. This will form step dis-
                        continuities at the MMIC’s input and output ports, creating 0.01 to 0.2 nH of
                        added series inductance. These step discontinuities can be minimized by
                        tapering the wider microstrip rapidly down to the narrower width of the
                        MMIC lead (Fig. 3.99). To minimize undesired inductance to the ground plane,
                        the MMIC’s ground leads are placed directly over the PCB’s through-hole vias,
                        as long ground leads lower gain and result in a poor P1dB. As a matter of prop-
                        er microwave and RF design, all grounds on the top side of the board should
                        lead directly to the bottom ground plane by the shortest possible route—which
                        is almost always through a direct through-hole via. In fact, some high-fre-
                        quency MMICs are so sensitive to this effect that substrates of not thicker
                        than 32 mils are recommended in order to lessen the inductive properties of
                        even a simple via. This is because a via passing through a 32-mil board can
                        have an inductance of approximately 0.15 nH, while vias through a 62-mil
                        board may have up to 0.5 nH of damaging inductance.


            3.5 Wideband Amplifiers
            3.5.1 Introduction
                        A wideband MMIC or discrete amplifier is designed to have an extremely
                        broad band of frequencies that it can pass with flat gain and (preferably) a
                        decent return loss response—along with perfect stability.
                          In order to properly design a discrete wideband RF amplifier we must sup-
                        press the lower frequencies, where the gain is the highest (Fig. 3.100a). One
                        way to do this is by giving these frequencies a poor impedance match, while
                        with the higher frequencies—where the gain is much less—we can give a per-
                        fect match. This will flatten the gain of the amplifier (Fig. 3.100b), but will not
























                        Figure 3.99 Proper board layout for an MMIC as seen from top of PCB.



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