Page 204 - System on Package_ Miniaturization of the Entire System
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178    Cha pte r  F o u r




                         S12  0
                         S13
                            –10

                            –20
                           Magnitude (dB)  –30




                            –40

                            –50

                            –60

                            –70
                                0        1        2         3        4        5        6
                                                      Frequency (GHz)
                    FIGURE 4.27  Model-to-hardware correlation. Dotted lines are Sonnet simulations, and continuous
                    lines are measured data.

                    device size under control, the balun has been implemented using all six-metal layers
                    offered by the technology—the capacitors have been implemented on the LCP layer, and
                    the inductors have been implemented as meandering lines on metal layers 2 and 5.
                       The fabricated devices measured 4 mm × 1.5 mm, with a total thickness of 0.75 mm.
                    Figure 4.27 shows the measured S  and S  of the device. The filter provides a minimum
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                    rejection of 20 dB across the cell-phone bands (GSM, EGSM, PCS, and DCS), while
                    maintaining an insertion loss below 2 dB. It is to be noted here that the filter itself has a
                    loss close to 1.7 dB in [43]. By careful design of the balun to minimize return losses, it is
                    possible to keep the total losses in the device to less than 2 dB.

                    4.2.6 Tunable Filters
                    Tunable filters are required for in-band tuning and for providing better matching to the
                    circuits at the input or the output of filters. Tunable filters can also be used to improve
                    the yield for correcting parametric defects during manufacturing (such as frequency
                    shifts). Tuning can be achieved by using variable capacitors such as varactor diodes or
                    by using electronic switches. Varactor diodes are reverse-biased diodes whose
                    capacitance can be varied by changing the voltage. These have a low Q (10 to 15 range)
                    and can load the filter, thereby increasing the insertion loss and in-band ripple. Electronic
                    switches such as GaAs and CMOS switches can be used to switch between a capacitor
                    array. These switches also have high insertion loss. The problems associated with these
                    implementations can be solved using MEMS variable capacitors or MEMS switches,
                    respectively. Using polymer MEMS processes, these devices can be integrated into the
                    substrate. In this section, the varactor implementation on embedded filters in LCP
                    substrates has been described. Even though the varactor diodes have a low  Q, the
                    performance of the tunable filter can be enhanced by using filters embedded in the
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