Page 70 - System on Package_ Miniaturization of the Entire System

Intr oduction to System-on-Chip (SOC) 47

SPDIF FPGA DAC–8
XT RCV C6711-150 MHz Conversion Ch 4
AL DIR1703 & PCM1738
CPU McBSP Clock Gen
McBSP
2 Ch ADC
PCM1804
SPDIF XMIT Otpo
DIT TX
XTAL OSC X4 PLL
EMIF

Micro Controller
RAM ROM

•Eliminate 7 ICs
•Reduce BOM
SPDIF DA610-225 MHz DAC–8 Ch •Reduce manf.
RCV cost
DIR1703 4 PCM1738 •Single processor
CPU McASP system
2 Ch ADC Otpo •Reduce time to
McASP
PCM1804
TX market
RAM
XTAL PLL & Osc ROM

FIGURE 2.6 SOC for high-performance audio.

audio DACs. The single-processor system also makes the software development
and debug simpler, thus enabling a faster time-to-market.
Figure 2.7 shows TMS320F2812—an SOC targeted for the embedded control
market. It integrates a high-performance 32-bit digital signal processor (DSP)
core customized for a control-type application, 128-kbytes of flash memory, a
12-bit analog-to-digital converter (ADC), and control-specific peripherals. This
is another example of an SOC addressing key customer requirements of system
cost, programmability, and time-to-market through level of integration and
application-specific IPs.
3. Embedded programmable processor cores As mentioned earlier, embedded
processor cores address the software programmability requirements. Since
programmability comes at the expense of area, power, and performance,
processor cores are customized and optimized for target application requirements.
The customization is done in terms of instruction set architecture, functional
units, pipelining, and memory management architectures. For control-dominated
code, code size and interrupt latency requirements drive the customization,
while for DSP applications, the performance for compute intensive kernels
drives the optimization. Depending on the application requirements, SOCs
embed one or more processor cores. The cycle time requirements typically drive