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172 Introduction to Microfabrication



             4. If a 20 nm thick titanium layer is used as a  Kiviranta, M. et al: Dc and un SQUIDs for read-out of ac-
                polish stop underneath 500 nm thick tungsten,  biased transition-edge sensors, IEEE Trans. Appl. Super-
                and film thickness non-uniformities are ±5% and  cond., 13 (2003), 614.
                CMP non-uniformity is ±10%, what must polish  Lin, S.Y. et al: A three-dimensional photonic crystal operating
                selectivity be?                           at infrared wavelengths, Nature, 394 (1998), 251.
             5. Work out a step-by-step fabrication process for the  Steigerwald, J.M., S.P. Murarka & R.J. Gutman: Chemical
                photonic crystal shown in Figure 16.8.    Mechanical Planarization of Microelectronic Materials, John
                                                          Wiley & Sons, 1997.
                                                         Stine, B.E. et al: Rapid characterization and modeling of
                                                          pattern-dependent variation in chemical-mechanical polish-
            REFERENCES AND RELATED READINGS               ing, IEEE TSM, 11 (1998), 129.
                                                         Wrschka, P. et al: Chemical mechanical planarization of cop-
                                                          per damascene structures, J. Electrochem. Soc., 147 (2000),
            Evans, D.R.: Slurry admittance and its effect on polishing,
              Mater. Res. Soc. Symp. Proc., 767 (2003), F5.1.1.  706.
            Hernandez, J. et al: Chemical mechanical polishing of Al and  Yasseen, A.A. et al: Chemical-mechanical polishing for poly-
              SiO 2 thin films: the role of consumables, J. Electrochem.  silicon surface micromachining, J. Electrochem. Soc., 144
              Soc., 146 (1999), 4647.                     (1997), 236.
            Jindal, A. et al: Chemical mechanical polishing of dielectric  Zhang, F. et al: Particle adhesion and removal in chemi-
              films using mixed abrasive slurries, J. Electrochem. Soc.,  cal mechanical polishing and post-CMP cleaning, J. Elec-
              150 (2003), G314.                           trochem. Soc., 146 (1999), 2665.
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