Page 203 - Sami Franssila Introduction to Microfabrication

182 Introduction to Microfabrication

Han, A. et al: A low temperature biochemically compatible Sakakuchi, K. et al: Current progress in epitaxial layer trans-

bonding technique using fluoropolymers for biochemical fer (ELTRAN ), IEICE Trans. Electron., E80-C (1997),
microfluidic systems, Proc. IEEE MEMS (2000), p. 414. 378.
Henttinen, K. et al: Mechanically induced Si layer transfer in Sakarya, S. et al: Technology of reflective membranes for
hydrogen-implanted Si wafers, Appl. Phys. Lett., 76 (2000), spatial light modulators, Sensors Actuators, A97–98 (2002),
2370. 468.
Huff, M.A. et al: Design of sealed cavity microstructures Shivkumar, B. & C.-J. Kim: Microrivets for MEMS packaging,
formed by silicon wafer bonding, J. MEMS, 2 (1993), p. 74 J. MEMS, 6 (1997), 217–225.
Jourdain, A. et al: Investigation of the hermeticity of BCB- Singh, A. et al: Batch transfer of microstructures using flip-
sealed cavities for housing (RF-)MEMS devices, Proc. IEEE chip solder bonding, J. MEMS, 8 (1999), 27.
MEMS (2002), p. 677. Takao, H. et al: A CMOS integrated three-axis accelerometer
Lee, B. et al: A study on wafer level vacuum packaging for fabricated with commercial CMOS technology and bulk
MEMS devices, J. Micromech. Microeng., 13 (2003), 663. micromachining, IEEE TED, 48 (2001), 1961.
Mack, S. et al: Analysis of bonding-related gas enclosure in Tong, Q.-Y. & U. G¨ osele: Semiconductor Wafer Bonding, John
micromachined cavities sealed by silicon wafer bonding, J. Wiley & Sons, 1999.
Electrochem. Soc., 144 (1997), 1106. Tsau, C.T., S.M. Spearing & M.A. Schmidt: Fabrication of
Niklaus, F. et al: Low-temperature full wafer adhesive bond- wafer-level thermocompression bonds, J. MEMS, 11 (2002),
ing, J. Micromech. Microeng., 11 (2001), 100–107. 641–647.
Ramm, P. et al: Three dimensional metallization for vertically Varma, C.M.: Hydrogen-implant induced exfoliation of silicon
integrated circuits, Microelectron. Eng., 37/38 (1997), 39. and other crystal, Appl. Phys. Lett., 71 (1997), 3519.