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LIGA and Micromolding                                                                       4-3



               Idea                                 Electroplate micromolds  Plastics replication  Bonding
                           Master fabrication                             Injection molding  With adhesives
               Design                               Seed layer            Hot embossing      With solvents
               CAD         Silicon bulk micromachining     - CVD/PVD metal  Plastics casting  With heat/pressure
               Photomask      - Wet etching         Electroplating
                              - Deep reactive ion etching     - Over Si
                           Photodefinable glass        - Over glass
                           Mechanical micromachining     - Over thick resists
                              - Micro - EDM            - Over bulk metal
                              - Excimer laser
                              - CNC machining
                           Lithography                 Deposition of         Casting
                              - Deep UV
                                                       electrical
                              - X-ray exposure (LIGA)  layer
                           E-beam machining
                           Ion-beam machining
                                                        Electroplating
                                                                            Pressure
                                                                              hot
                             Silicon bulk               Backside           embossing
                             micromachining             planarization

                                                                           Heat
                             Mechanical                                         Heat
                             micromachining           Separation mold           Pressure
                                                      insert from master
                                                                           Injection
                                                                           molding
                                Lithography

             FIGURE 4.2 Process flow for plastic microfabrication.




               Micromachining techniques are reshaping manufacturing approaches for a wide variety of small parts.
             Frequently, IC-based batch microfabrication methods are considered along with more traditional serial
             machining  methods. In  this  evolution, LIGA  and  pseudo-LIGA  processes constitute “handshake-
             technologies” bridging IC and classical manufacturing technologies. The capacity of LIGA and pseudo-
             LIGA for creating a wide variety of shapes from different materials makes these methods akin to classical
             machining, with  the  added  benefit  of unprecedented  aspect  ratios  and  absolute tolerances rendered
             possible by lithography and other high-precision mold fabrication techniques.
               In this chapter, after a historical introduction to LIGA, we will analyze the process steps depicted in
             Figures 4.1 and 4.2. We start with a description of the different applications and technical characteristics
             of synchrotron radiation and then present an introduction to the crucial issues involved in making X-ray
             masks optimized for LIGA. Emphasis is on the two most important additive steps in LIGA and LIGA-like
             methods: electro- and electroless deposition of metals and plastic micromolding. Micromolding with an
             elastomeric mold, one of the many types of soft lithography, is widely used in research due to its low cost
             and  easy  implementation. Bonding  of plastic  molded  micro  parts, including  plastic welding, organic
             solvent bonding, and bonding with thermoset adhesives, is covered in Madou (2002).



             4.2 LIGA — Background

             4.2.1 History

             LIGA combines the sacrificial wax molding method, known since the time of the Egyptians, with X-ray
             lithography and electrodeposition. Combining electrodeposition and X-ray lithography was first carried
             out by Romankiw and co-workers at IBM as early as 1975 [Spiller et al., 1976]. These authors made high-
             aspect-ratio metal structures by plating gold in X-ray-defined resist patterns of up to 20 µm thick. They
             had, in other words, already invented “LIG”; that is, LIGA without the abformung (molding) [Spiller et al.,



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