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FUNDAMENTALS                                           CH. 4 CONTROL OF NANOSTRUCTURE OF MATERIALS
                    4.5.4.3 FSP and formation of surface partial composite  [11] H. Fujii, R. Ueji, Y. Takada, H. Kitahara, N. Tsuji,
                  Although FSW was initially a technology developed  K. Nakata and K. Nogi: Mater. Trans., 47, 239–242
                  as a joining method of metals, a field called friction  (2006).
                  stir process (FSP) has spread, since it is possible to  [12] R.S. Mishra, M.W. Mahoney, S.X. Mcfadden,
                  obtain a refined microstructure and to partially   N.A. Mara and A.K. Mukherjee: Scripta Mater., 42,
                  strengthen a material using this technique [12–17].  163–168 (1999).
                  Furthermore, it has recently become clear that the  [13] H.J. Liu, H. Fujii and K. Nogi: Mater. Sci. Tech., 20,
                  grains are further refined by dispersing small parti-  399–402 (2004).
                  cles such as ceramic particles [18, 19], carbon nan-  [14] Z.Y. Ma, R.S. Mishra and M.W. Mahoney:  Scripta
                  otubes [20], and C [21] into metal.
                                 60
                    Morisada et al. [19–21] engraved the sample sur-  Mater., 50, 931–935 (2004).
                  face (AZ31) with a slot having a 1 mm width and 2  [15] M.L. Santella,  T. Engstron, D. Storjohann and
                  mm depth, filled it with carbon nanotubes, C 60  or  T.Y. Pan: Scripta Mater., 53, 201–206 (2005).
                  ceramic particles, and then performed FSP on the  [16] I. Charit, R.S. Mishra:  Acta Mater.,  53, 4211–4223
                  plate, as nanostructures, such as carbon nanotubes,  (2005).
                  cannot easily be dispersed in a metal by a liquid-phase  [17] J.Q. Su,  T.W. Nelson and C.J. Sterling:  Mater. Sci.
                  method. Because the distribution of these particles  Eng. A, 405, 277–286 (2005).
                  can restrict the grain growth, the crystal grain is much  [18] R.S. Mishra, Z.Y. Ma and I. Charit: Mater. Sci. Eng.
                  smaller than that in the simply FSPed sample, as   A, 341, 307–310, (2003).
                  shown in Fig. 4.5.24, which can significantly improve  [19] Y. Morisada, H. Fujii, T. Nagaoka and M. Fukuzumi:
                  the hardness from 41 Hv of the base material to 78
                  Hv.  When only FSP is performed, the hardness      Mater. Sci. Eng. A., 433, 50–54 (2006).
                  increases only to 55 Hv.                       [20] Y. Morisada, H. Fujii, T. Nagaoka and M. Fukuzumi:
                    Because the thermal stability of the FSPed part is  Mater. Sci. Eng. A., 419 344–348 (2006).
                  lower due to the introduction of a distortion into the  [21] Y. Morisada, H. Fujii, T. Nagaoka and M. Fukuzumi:
                  metal, the crystal grain can become larger than that of  Scripta, 55, 1067–1070 (2006).
                  the base material due to remarkable grain growth
                  when the temperature is raised after the FSP as shown
                  in Fig. 4.5.25. However, when SiC particles are dis-  4.5.5 Aerosol deposition method for nanostructuring
                  tributed, the grain growth is restricted and the thermal  of crystal layer and its applications
                  stability is significantly improved.
                                                                 Within the field of nanotechnology research, the
                                                                 study of nanoparticles has become an active research
                                   References                    topic. In addition, fabrication technologies to realize
                                                                 nanostructure materials and to use nanoparticles for
                   [1] H. Okamura, K.  Aota and M. Ezumi:  J. Jpn. Inst.  thin-film coatings are also being actively studied.
                      Light Met., 50, 166–171 (2000).            Although thermal spray-coating technology using
                   [2] G. Campbell, T. Stotler: Weld. J., 78, 45–47 (1999).  powders as a source material has been used for a long
                   [3] M.R. Johnsen: Weld. J., 78, 35–39 (1999).  time, its applications have been limited because the
                                                                 high temperatures needed do not permit the forma-
                   [4] K.E. Knipstron, B. Pekkari:  Weld. J.,  76, 55–57
                                                                 tion of films with acceptable electrical and mechani-
                      (1997).
                                                                 cal properties. Many of the problems with existing
                   [5] C.J. Dawes, W.M. Thomas: Weld. J., 75, 41–45 (1996).
                                                                 coating techniques have been solved, however, by
                   [6] W.M.  Thomas, E.D. Nicholas, J.C. Needhan, M.G.
                                                                 impacting dry powders with substrates to be coated at
                      Murch, P.  Temple-Smith and C.J. Dawes:    impact velocities of several hundreds of meters per
                      International Patent Application PCT/GB92/02203  second. It is thought that reaction zones with high
                      and GB Patent Application 9125978.8, UK Patent  temperature and high pressure are formed when par-
                      Office, London, December 6, 1991.          ticles release kinetic energy during high-energy
                   [7] C.J. Dawes, W.M. Thomas: Weld. J., 53, 41 (1996).  impacts, permitting them to collide and bond firmly
                   [8] Japan Welding Society: Friction Stir Welding, Sanpo  with a substrate. The advantage of such a process is
                                                                 that nanostructured layers can be formed at lower
                      Publication, Tokyo (2006).
                                                                 temperatures than other spray-coating techniques,
                   [9] H. Fujii, R. Ueji, Y. Takada, H. Kitahara, N. Tsuji,
                                                                 producing films with superior electrical and
                      K. Nakata and K. Nogi: Mater. Trans., 47, 239–242
                                                                 mechanical properties.
                      (2006).
                                                                  This method is called the aerosol deposition
                  [10] O. Frigaard, O. Grong, B. Bjorneklett and O.T. Midling:  method (AD). In this paper we explain the principle of
                      Proceedings of the Ist International Symposium on  the AD method and its application to ceramic film
                      FSW,  Thousand Oaks, USA, 14–16 June, 1999,   formation for information/communication and energy
                      8-2CD-ROM.                                 technology applications.
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