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1. NANOELECTROMECHANICAL SYSTEMS                                17


             1.2.2.1 Surface Micromachining

                In surface micromachining, 3-D mechanical structures are constructed in
             a layered fashion.  Two types of  layers, based on their material
             composition/etching properties, are employed, namely, sacrificial  and
             structural layers. The  former  are ultimately dissolved  via a process  step
             named  release,  and the latter  remain, becoming part of  the  free-standing
             movable  structure  proper.  The simplest element illustrating the surface
             micromachining  technique is, perhaps, the cantilever  beam. Figure 1.13
             sketches its formation.  Typical  combinations of sacrificial and structural
             materials, and corresponding etchant are shown in Table 1.5 [27].



                                                               TO P  V IEW
                         S IDE  VIE
                         S IDE  VIE W W                        TO P  V IEW
                                              S a crificial la yer er
                                              S a crificial la y
                                                Wa fe
                                                Wa fer r
                                             S tru ctu ral la ye
                                            S tru ctu ral la yer r

                                               Bea m
                                               Bea m




                 P rocess seq u en
                 P rocess seq u ence ce
             Figure 1-13. Sketch of the formation of a cantilever beam by surface micromachining. From
             top to bottom of the figure, the sacrificial material is deposited and patterned (top), then the
             structural material is deposited and patterned (middle),  the  sacrificial  layer  is  released
             (bottom).
                       Table 1-5. Structural/Sacrificial/Etchant Material Systems [27].
                 Structural Material   Sacrificial Material   Etchant
                 Aluminum           Single-crystal silicon   EDP, TMAH, XeF 2
                 Aluminum           Photoresist       Oxygen plasma
                 Copper or Nickel   Chrome            HF
                 Polyimide          Aluminum          Al etch (Phosphoric, Acetic,
                                                      Nitric Acid)
                 Polysilicon        Silicon dioxide   HF
                 Photoresist        Aluminum          Al etch (Phosphoric, Acetic,
                                                      Nitric Acid)
                 Silicon dioxide    Polysilicon       XeF 2
                 Silicon nitride pr Boron-  Undoped polysilicon   KOH or TMAH
                 doped polysilicon
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