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6 The Power MOSFET                                                                                   99

                       TABLE 6.3  Comparison of power semiconductor devices

                       Device type   Year made available  Rated voltage  Rated current  Rated frequency  Rated power  Forward voltage
                       Thyristor (SCR)  1957          6 kV        3.5 kA       500 Hz        100's MW    1.5–2.5 V
                       Triac         1958             1 k V       100 A        500 Hz        100's kW    1.5–2 V
                       GTO           1962             4.5 kV      3 k A        2 kHz         10's MW     3–4 V
                       BJT (Darlington)  1960 s       1.2 kV      800 A        10 kHz        1 MW        1.5–3 V
                       MOSFET        1976             500 V       50 A         1 MHz         100 kW      3-4 V
                       IGBT          1983             1.2 kV      400 A        20 kHz        100's kW    3–4 V
                       SIT                            1.2 kV      300 A        100 kHz       10's kW     10–20 V
                       SITH          19               1.5 kV      300 A        10 kHz        10's kW     2–4 V
                       MCT           1988             3 kV        2 kV         20–100 kHz    10's MW     1–2 V


                                 As power rating increases,           designed and fabricated on a single chip. Such power IC
                  P                frequency decreases
                                                                      modules are called ‘‘smart power'' devices. For example,
                                                                      some of today's power supplies are available as ICs for use
                                                                      in low-power applications. No doubt the development of
                  Power (kW) 10 5  SCR  GTO  MCT                      smart power devices will continue in the near future, addres-
                                                                      sing more power electronic applications.
                   10 4
                                 SITH
                   10 3              BJT
                                                       As frequency increases,
                                                        power decreases
                   10 2                   IGBT                        References
                                                                       1. B. Joyant Baliga, Power Semiconductor Devices, PWS Publishing, New
                                                                         York, 1996.
                   10 1
                                                  MOSFET
                                                                       2. Lorenz, Marz and Amann, ‘‘Rugged Power MOSFETÐ A milestone
                                                                         on the road to a simpli®ed circuit engineering,'' SIEMENS Application
                   10 0
                    10 0  10 1  10 2  10 3  10 4  10 5  10 6  10 7  10 8  Notes on S-FET Application, 2000.
                                       Frequency (Hz)                  3. M. H. Rashid, Microelectronic Circuits: Analysis and Design, PWS
                    FIGURE 6.31  Power vs frequency for different power devices.  Publishing, Boston: MA, 1999.
                                                                       4. A. Sedra and K. Smith, Microelectronic Circuits, 4th Ed., Oxford
                                                                         Series, Oxford Univ. Press, Oxford, 1996.
                 continue to drive the research and development in semicon-  5. Ned Mohan, T. M. Underland, and W. M. Robbins, Power Electronics:
                 ductor technology. From power MOSFET to power MOS-      Converters, Applications, and Design, 2nd Ed., John Wiley, New York,
                 IGBT and to power MOS-controlled thyristors, power rating  1995.
                 has consistently increased by factor of 5 from one type to  6. Richard and Cobbald, Theory and Applications of Field Effect Tran-
                 another. Major research activities will focus on obtaining new  sistors, John Wiley, New York, 1970.
                                                                       7. R. M. Warner and B. L. Grung, MOSFET: Theory and Design, Oxford
                 device structures based on MOS-BJT technology integration
                                                                         Univ. Press, Oxford, 1999.
                 so as to rapidly increase power ratings. It is expected that the  8. D. K. Schroder, Advanced MOS Devices, Modular Series on Solid State
                 power MOS-BJT technology will capture more than 90% of  Devices, MA: Addison Wesley, 1987.
                 the total power transistor market.                    9. J. G. Gottling, Hands on pspice, Houghton Mif¯in Company, New
                   The continuing development of power semiconductor tech-  York, 1995.
                 nology has resulted in power systems with driver circuit, logic  10. G. Massobrio and P. Antognetti, Semiconductor Device Modeling with
                 and control, device protection and switching devices being  PSpice, McGraw-Hill, New York, 1993.
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