Page 13 - Semiconductor Manufacturing Handbook

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HOW SEMICONDUCTOR CHIPS ARE MADE

1.12 SEMICONDUCTOR FUNDAMENTALS AND BASIC MATERIALS

FIGURE 1.8 Packaged microprocessors.

Each packaged chip is loaded on the testing board to test one more time, marking the last step in
the chip-making process. The chips would be electrically stressed far beyond normal conditions, so
weak chips are forced to fail before they are put into customers’ products. The chips are now ready
for shipping to companies that will use them to make everyday items.

REFERENCES

1. Hammond, M. L., “Moore’s Law: The First 70 Years,” Semiconductor International, 2004.
2. Intel, Inc., http://www.intel.com/education/makingchips.
3. Rabaey, J. M., A. Chandrakasan, and B. Nikolic, Digital Integrated Circuits, pp. 33–55, 2d ed., Prentice-Hall,
New Jersey, 2002.
4. Elliott, D., Microlithography Process Technology for IC Fabrication, pp. 311–350, McGraw-Hill, New York,
1986.

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