Page 199 - Semiconductor Manufacturing Handbook
P. 199

Geng(SMH)_CH13.qxd  04/04/2005  19:51  Page 13.22




                                                 PHYSICAL VAPOR DEPOSITION

                   13.22  WAFER PROCESSING

                   REFERENCES

                                1. Obermeier, E., Technologien der Mikrosysteme I, Lecture scriptum, Berlin, Germany, 2002.
                                2. Wehl, W., Mikrotechnische Fertigung, Lecture Scriptum, Heilbronn, Germany, 2002.
                                3. Menz, W. , Mikrosystemtechnik für Ingenieure, VCH Verlag, Weinhein, Germany, 1997.
                                4. Schade, K., Mikroelektroniktechnologie, Verlag Technik, Berlin, Munich, Germany, 1991.
                                5. Pupp, W., Vakuumtechnik, Hanser Verlag, Munich, Germany, 1991.
                                6. West, R. C., et al. (eds.), CRC Handbook of Chemistry and Physics, CRC Press, Boca Raton, Florida, 1987.
                                7. Suntola, T., Thin Solid Films, 216, 1992, p. 84.
                                8. Ritala, M., M. Leskelä, and In: Nalwa, H. S., (eds.), Handbook of Thin Film Materials, Vol. 1, Chap. 2,
                                  Academic Press, San Diego, 2001.
                                9. Ritala, M., and M. Leskelä, M. Nanotechnology, 10, 1999, p. 19.
                               10. Leskelä, M., et al. (eds.), Atomic Layer Epitaxy, Chap. 1, Blackie and Son, Glasgow, Scotland, 1990.
                               11. Juppo, M., “Atomic Layer Deposition of Metal and Transition Metal Nitride Thin Films and In Situ Mass
                                  Spectrometry Studies,” Academic Dissertation, University of Helsinki, Laboratory of Inorganic Chemistry,
                                  Helsinki, Finland, 2001.
                               12. Beyer, G., and M.  Van Bavel, “Using  Atomic Layer Deposition to Prepare Future-Generation Copper
                                  Diffusion Barriers,” Micromagazine, 2002.













































                          Downloaded from Digital Engineering Library @ McGraw-Hill (www.digitalengineeringlibrary.com)
                                     Copyright © 2004 The McGraw-Hill Companies. All rights reserved.
                                       Any use is subject to the Terms of Use as given at the website.
   194   195   196   197   198   199   200   201   202   203   204