Page 565 - DSP Integrated Circuits

550 Chapter 12 Integrated Circuit Design

Figure 12.19 Floor plan for the interpolator

The die size must therefore be increased so that the circumference of the
active circuitry becomes at least 48 • 0.135 ~ 6.5 mm. We may choose to increase
2
the size to 1.9 x 1.4 = 2.7 mm . The pads and the necessary scribe margin add
2
another 0.5 mm on each side. The required die size is 2.9 x 2.4 ~ 7.0 mm . Hence,
only 32% of the die is used for active circuitry. The interpolator is obviously a pad-
limited circuit.
The power consumption for each adaptor is about 180 mW. The power con-
sumption for the complete interpolator is estimated as
P-0.9W