Page 60 - DSP Integrated Circuits
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2.3 MOS Logic                                                          45


        power consumption is one of the most important constraints in integrated circuit
        design.
            The current in a wire must not be too large because of electromigration [2,7].
                                                                         2
        Typically, a metal wire may not carry a current of more than ~ I mA/(|Lim) . A min-
                               5
        imum-width metal 2 wire  (width = 1.6 um and thickness of 1 um) that is used for
        power and ground routing can therefore only support up to 1.6 mA/35 joA ~ 45 min-
        imum-size CMOS inverters of the type used in Example 2.2. The lower layer
        (metal 1) has typically a thickness of only 0.6 urn.
            As mentioned before, CMOS circuits have negligible static power dissipation.
        The leakage current is in the nanoampere range. Typically the power consumption
        due to leakage is less than 1% of the total power consumption. If the slope of the
        input signal is small or the transistor sizes are very large, as is the case in large
        buffers, a power supply current flows when both the p- and n-transistors conduct.
        However, for normal logic gates and input signals, the power consumption due to
        this current is less than 10% of the total power consumption. Significant power is
        dissipated when the output switches from one state to the other. The stray and
        load capacitances are, during a complete switch cycle, charged and discharged
        through the p-transistor and the n-transistor, respectively. Thus, the average
        power supply current is


        if the inverter is switched with the frequency/", and A Vis the output voltage swing.
        The swing for CMOS circuits is typically VDD- The power dissipation associated
        with the CMOS inverter is



            With C L = 105 fF, V DD = 5 V, and /= 1/16 ns = 62.5 MHz, we get an average
        power dissipation of 156.3 uW, which agrees well with the values in Table 2.2.


        2.3.5 Precharge-Evaluation Logic
        The 1990s witnessed the proposals of
        many variations of dynamic logic [2, 5, 7,
        23—25]. They differ in various aspects,
        such as maximum clocking speed, transis-
        tor count, area, power consumption, and
        charge leakage in storage nodes. In pre-
        charge-evaluation logic, only one switch
        network is used together with clocking
        transistors.
            Figure 2.17 shows a precharge-evalua-
        tion circuit with a switch network with
        only n-transistors. Two clocking transistors
        are used in this circuit. The upper transis-
        tor is a precharge pMOS transistor. The
        lower transistor is an nMOS transistor in  Figure 2.17 Precharge-e valuation logic



        5
         -  The second metal layer, on top of the first metal layer (metal 1), is called metal 2.
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