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                                                     Fibre glass insulating pad
















           Figure 31.5(a)  Typical insulating practice to isolate enclosure of a discontinuous  IPB system (Courtesy: Best & Crompton)


          Main bus conductor                           Figures  31.7 and  31.8  illustrate  the  disposition  of  the
                                                       conductor and the enclosure fields in the space and their
                                                       nullification, where
                                                       I, = conductor current
                                                       I, = enclosure current
                                                       I, and I,  are almost  180" out of phase.
                                                       therefore,    (I, - I,)
                                                        For better shielding it is essential that bonding is carried
                                                       out  at  the  farthest  possible  locations  where  the  con-
                                                       figuration of the IPB changes such as at the bends and
                                                       tap-offs or where it passes through a wall. Where bonding
                                                       is not possible, the supports and the enclosure must be
                                                       adequately reinforced to sustain electrodynamic forces,
                                                       especially  during a  fault. Figure 3 1.2(b) illustrates the
                                                       shorting and grounding locations of an IPB system.
                                                        To  limit  the  fault  level, if  it  is  likely  to  exceed  the
                                                       designed limits, or the breaking capacity of the interrupting
                                                       device, or the associatedequipment and to limit the induced
           AI. shorting band                           circulating currents  in  the  enclosure  during  normal
                                                       operation, to contain enclosure losses in very large ratings
           Support insulator
                                                       of bus systems, say, 25 OOOA and above (above 500 MW),
                                                       then unsaturable type series reactors (for details refer to
                                                       Chapter 27) may be provided in the enclosure circuit, as
           insulating pad                              illustrated  in  Figure  31.8  to  limit  such  high  currents
           Galvanized steel                            especially during a fault. The reactors should not saturate
           support structure                           under fault conditions, as they are provided to supplement
                                                       the enclosure circuit impedance to limit the high currents
                                                       through the enclosure, especially during faults, and reduce
        Figure 31.5(b)  Cross-sectional view of  an IPB with insulated   the forces between the main conductors. For a better flow
        (discontinuous) enclosure illustrating busbar-supporting
        arrangement  (Courtesy: Best & Crompton)       of  circulating currents,  it is also grounded only at one
                                                       point. Accordingly,  it  is  supported  on  non-conducting
                                                       supports to keep the ground path continuous and completely
                                                       isolated. The enclosure must also be insulated electrically
        nullifies  the  proximity  effect  and  helps  to  reduce  the   from the rest of the plant by rubber bellows.
        heating of  such structures to a very great extent.   A  continuous  enclosure  provides  a  high  degree  of
          The electrodynamic and electromagnetic forces between   magnetic  shielding  for  metallic  objects  and  structures
        the  conductors  and the  structures  are  also  reduced  to   located in the vicinity and generates only nominal eddy
        only 10-15%  or even less. These two advantages are not   current  or  hysteresis  losses.  Magnetic  shielding  also
        available to this extent  in  a non-continuous enclosure.   significantly reduces the electrodynamic stresses caused
        The  induced  current causing the magnetic field in  the   by  short-circuits  on  the  structures and  between  the
        space is now reduced to only,                  enclosures of the other phases. For details on the thickness
                                                       and size of enclosure to provide magnetic shielding up
                                               (31.1)   to a  required  level,  refer  to the  sample calculations  in
                                                       Example 3 1.1 and further reading at the end of this chapter.
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