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                    FIGURE 3.5  Shear driven temperature cycle failure at a solder joint.


                    and the brittle intermetallic interfaces also govern the failure mode in drop conditions.
                    Figure 3.6 shows a typical brittle intermetallic failure.

                    3.2.3 Electrical Challenges
                    With the increased die or chip stacking, the density of I/O interconnections is increased
                    dramatically. Moreover, for high-performance requirements, the interconnect speed through

































                    FIGURE 3.6  Failure of a solder joint during drop testing.
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