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Chip carriers
Conductive epoxy
(a)
Metal traces
(b)
FIGURE 3.39 The earliest PoP stacking by employing side termination interconnection methods
with (a) conductive polymer [43], and (b) metal traces. [44]
Overmold
Flash stack
Spacer
xRaM
WB logic silicon Package-to-package
interconnect
FIGURE 3.40 Stacked package with ball grid array interconnects, leading to PoP stacking.
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