Page 121 - Microsensors, MEMS and Smart Devices - Gardner Varadhan and Awadelkarim

Table 4.7 Characteristics of common IC packages. From Ginsberg (1992)
Package Range of physical Electrical Thermal Usable gates Relative cost
type dimensions characteristics characteristics (per pin)
(°C/W)
Through-hole DIP 16 to 64 pins 100 mils pin R: medium Ceramic/plastic Up to 1
pitch 0.75 to 2.3 in body L: high 70-40/120-80 17000
length 0.3 to 0.7 in body C: low
width
Surface mount SOIC 16 to 28 pins 10 mils pin pitch R: medium Ceramic/plastic Up to 6500 Ceramic 6
50 to 70 mils body length L: medium 110-80/130-105 Plastic
0.3 to 0.4 in body width C: low 2.5
Surface mount OFPT 48 to 260 pins 10 mils pin R: medium Plastic 95-60 Up to 6
pitch 0.65 to 1.7 in body L: medium 17000
width C: low
Surface mount CLCC 28 to 84 pins 40 to 50 mils pin R: medium Ceramic 70-45 Up to 30
pitch 0.45 to 0.97 in body L: medium 25 000
width C: medium
Surface mount PLCC 28 to 84 pins 50 mils pin pitch R: medium Plastic 65-50 Up to 2
0.49 to 1.19 in body width L: medium 17000
C: low
Through-hole PGA 64 to 299 pins 70 mils pin Ceramic/plastic Ceramic/plastic Up to Ceramic 60
pitch 1.033 to 1.7 in body R: low/low 40-19/46-38 75000 Plastic 12
width L: low/low
C: high/low

Note: R: Resistance, L: Inductance, C: Capacitance. Assumes 1.5 urn CMOS technology for usable gates.