Page 231 - Microsensors, MEMS and Smart Devices - Gardner Varadhan and Awadelkarim

COMBINED SILICON AND POLYMERIC STRUCTURES 211

Micromotor Support
Substrate
1. Make a substrate with
functional elements

Glue mechanism

2. Make glue mechanisms
by photoforming

Next substrate

3. Pile up next substrate
and remove supports

Figure 7.50 Fabrication of combined architecture. From Takagi and Nakajima (1994)

1
(h —JlL^Jl Position the elevator
11=5=
__^_J|
near the window
j
Elevator driver
1H— til , t-Jj n Scan the beam
|L=^ Liiri:
along the first layer
Laser oscillator
{
Resin container
n n Finish the first layer
1
Condenser
Pin hole & „ || Pull up the elevator
Beam shutter Head driver Lr* .'— ', 1 — ' for thickness of one layer
t

ill Repeat these operations
1— c^
to make the object shape
"f
•^ — n
^
^
Figure 7.51 Microscale photoforming MSL: (a) configuration of forming devices and (b) forming
sequence. From Takagi and Nakajima (1994)