Page 188 - Semiconductor Manufacturing Handbook

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PHYSICAL VAPOR DEPOSITION

Target atoms

Target surface

Angle of
impact a

+ O
Removed Ar-ion Backscattered Removed
target atom neutral Ar atom target atom
FIGURE 13.11 Schematic of propagation of momentum and particle movements of
Ar ions hitting a sputter target surface.
3
Ag
Ar +
2.5

Au
2
Sputter yield 1.5 Cu Pd

Cr Co Ni Pt
1
Fe Ge Ru Ir
Al Re U
Zr Mo Hf Os
0.5
Be V Nb Ta W
Si Ti Th
C
0
6 14 22 24 27 29 40 42 46 72 74 76 78 90
Atomic number
FIGURE 13.12 Sputter yield as a function of target atomic number. 4

Zone T Zone 2 Zone 3
Zone 1

T/T m
Inert gas pressure
FIGURE 13.13 Zone model of a layer surface structure for sputtered
layers. 3

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